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Wafer cartridge and manufacturing method thereof

A cassette and wafer technology, applied in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve problems such as low precision, strength structure, wafer bounce, etc., to achieve enhanced accuracy and enhanced strength Effect

Pending Publication Date: 2018-10-16
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The structure of the traditional wafer cassette has defects, which often cause the manipulator (especially the front end of the manipulator) to accidentally hit the bottom of the wafer cassette due to misalignment, thus causing the wafer to fall
[0005] In view of the low accuracy, strength and structural defects of traditional wafer cassettes, it is urgent to propose a novel wafer cassette to improve its structure and enhance its accuracy and strength

Method used

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  • Wafer cartridge and manufacturing method thereof
  • Wafer cartridge and manufacturing method thereof
  • Wafer cartridge and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0027] figure 1 The perspective view of FIG. 2 shows a wafer cassette 100 according to an embodiment of the present invention, which is used for storing and transporting wafers. figure 2 show figure 1 Another perspective view of the wafer cassette 100 of FIG. 10 , which holds a wafer 10 , such as an optical component (such as an optical lens or glass). To make the internal structure easier to see, figure 2 The illustrated wafer cassette 100 omits some components which are not shown.

[0028] In this embodiment, the wafer cassette 100 may include a front panel 11 and a rear panel 12 , which are opposed to each other. The wafer cassette 100 of this embodiment may further include at least two long top pins 13 , at least two long middle pins 14 and at least two long bottom pins 15 . Each of the long top bar 13 , the long middle bar 14 and the long bottom bar 15 has a plurality of grooves. The groove can completely surround the long top bar 13 , the long middle bar 14 , and ...

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PUM

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Abstract

The invention proposes a wafer cartridge and a manufacturing method thereof. The wafer cartridge comprises a front panel, a rear panel, at least two lone top rods, at least two long intermediate rodsand at least two long bottom rods, wherein the front panel and the rear panel are independent to each other, a plurality of grooves are formed in each long top rod, each long intermediate rod and eachlong bottom rod, each long top rod, each long intermediate rod and each long bottom rod are provided with two ends respectively pivoted with the front panel and the rear panel, each long top rod, each long intermediate rod and each long bottom rod respectively comprises a solid iron core, and a surface of the solid iron core is coated with a coating layer.

Description

technical field [0001] The present invention relates to a wafer cassette, in particular to a wafer cassette with improved structure and enhanced precision and strength. Background technique [0002] A wafer cassette is a device used to hold wafers to facilitate transport between equipment for wafer processing or measurement. Wafers stored in wafer cassettes can be taken out or placed using a robotic hand or a fork. [0003] The accuracy or strength of traditional wafer cassettes will decrease after being used for a period of time. For example, thermal contraction and thermal expansion will reduce the accuracy or strength of the wafer cassette. [0004] The structure of the traditional wafer cassette has defects, which often cause the manipulator (especially the front end of the manipulator) to accidentally bump into the bottom of the wafer cassette due to misalignment, thus causing the wafer to bounce off. [0005] In view of the low accuracy, strength and structural defe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673H01L21/677
CPCH01L21/67333H01L21/67703
Inventor 张瑞堂卢芳万
Owner HIMAX TECH LTD