Mixed pressing plate machining method and system, computer storage medium and equipment

Abstract

The invention relates to a mixed pressing plate machining method and system, a computer storage medium and equipment. The machining method comprises the following steps of obtaining first preset machining data; obtaining first preset collapsible data; obtaining second preset machining data; obtaining second preset collapsible data; according to a first preset requirement, processing the data, andobtaining first machining data; on the basis of the first machining data, machining a mixed pressing plate. According to the machining system, the computer storage medium and the equipment, the hardware or software basis is provided for the machining method. The first preset collapsible data of a high frequency plate and the second preset collapsible data of a common plate are obtained, processingis performed on the basis of the first preset requirement, the first preset machining data and the second preset machining data, and therefore the first machining data is obtained; then, the mixed pressing plate is machined and obtained on the basis of the first machining data, the problem that different layer plates are defective or scrapped due to inconsistent collapsing is avoided, and the production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing method, processing system, computer storage medium and equipment of a mixed-press board. Background technique [0002] PCB (Printed Circuit Board), usually called a circuit board, also known as a printed circuit board or a printed circuit board, is a support for electronic components and a carrier for electrical connections of electronic components. With the continuous development of the electronics industry, especially the increasing development of wireless networks and satellite communications, information products are developing towards high-speed and high-frequency, and communication products are developing towards wireless transmission with large capacity and fast speed. Development needs, and has been developed rapidly. The manufacturing cost of high-frequency boards is high. In order to control production costs and meet functional requirement...

AI Technical Summary

Problems solved by technology

[0003] The processing of circuit boards involves many processes, and different processes may cause different expansion or contraction of the laminates of the circuit board, which will lead to inconsistent expansion and contraction between different laminates after lamination, which will not meet the expected requirements, resulting in later stages. Further processing, such as drilling, will cause the product to be inconsistent with the actual product, causing the circuit board to fail to achieve the intended function, resulting in defective products or scrapping

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