Production process of semiconductor diode

A production process and diode technology, applied in the field of semiconductor diode production process, can solve the problems of pin scratches, unadjustable pin bending angle, low product applicability, etc.

Active Publication Date: 2018-10-19
吉林瑞能半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this solution, the pins rub against the lower mold during bending, which leads to scratches on the pins, which in turn leads to quality problems; the bending angle of the pins cannot be adju

Method used

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  • Production process of semiconductor diode
  • Production process of semiconductor diode
  • Production process of semiconductor diode

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Embodiment approach

[0038] As an embodiment of the present invention, the bending module 3 includes a positioning plate 31, an adjusting plate 32, a No. 1 roller 33, an adjusting screw 34, a hand wheel 35, a No. 2 roller 36, and an electric cylinder 37. The positioning plate One end of 31 is hinged to the edge of the top side of lower die 2; the top surface of the positioning plate 31 is provided with a group of No. 1 positioning grooves 311, and the bottom surface of one end of the positioning plate 31 is hinged to one end of the adjusting plate 32; the adjusting plate 32 is L-shaped; The adjusting screw 34 is connected with the adjusting plate 32 by threads; one end of the adjusting screw 34 is fixedly connected with the handwheel 35, and the other end of the adjusting screw 34 is connected with the No. 1 roller 33 through a rotating shaft; Between 32, the No. 1 roller 33 is driven by the adjusting screw 34 to realize the adjustment of the angle between the positioning plate 31 and the adjusting...

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PUM

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Abstract

The invention belongs to the technical field of semiconductor diode manufacturing, and particularly relates to a production process of a semiconductor diode. The process comprises the following stepsthat a chip and a lead of the semiconductor diode are installed into a graphite boat, the graphite boat is fed into a welding furnace, and the chip of the semiconductor diode is connected with the metal lead; the welded semiconductor diode is placed in an acid pickling machine for acid pickling; the semiconductor diode subjected to acid pickling is dried after being cleaned, and the semiconductordiode is placed into a dispensing machine for dispensing drying; the semiconductor diode obtained after dispensing drying is placed into a pin forming device to be formed; and the formed semiconductordiode is subjected to surface treatment, and after testing, finish product packaging is carried out. According to the production process, bending modules are hinged to the two sides of the top of a lower mold, and the bending modules swing around the hinged portions when the lower mold moves downwards to achieve pin bending; and a dust removal module is arranged on the non-hinged side of each bending module, and dust in first locating grooves of the bending modules is removed.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode manufacturing, in particular to a semiconductor diode production process. Background technique [0002] Diode bending foot forming process is already a relatively mature process in the market, and there are also various automation equipment, which can solve the forming process of product diversification. But the disadvantages are also obvious. It is suitable for products with large quantities and few varieties, and it must be a braided product. There are also limitations on the thickness of the pins, and it cannot be popularized to all products. And the equipment cost is also high, it is impossible to standardize and automate the production of all products used. Usually, for small-batch products and repairs and supplements, most of them are carried out by manual bending. This method is difficult to guarantee dimensional accuracy, affects product quality, and is inefficient and labor-i...

Claims

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Application Information

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IPC IPC(8): B21F1/00B08B1/00
Inventor 陈欣洁王勇
Owner 吉林瑞能半导体有限公司
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