Wafer wet method etching system

Abstract

The invention belongs to the technical field of wet method etching and specifically relates to a wafer wet method etching system comprising a mobile module, a grabbing module, a number one reaction tank, a number two reaction tank, a number three reaction tank and a material storage cylinder; the number one reaction tank, the number two reaction tank and the number three reaction tank are fixedlymounted on a bottom surface of an inner wall of the reaction bin; the mobile module is fixedly mounted on a top part of a side surface of the inner wall of the reaction bin, the grabbing module is mounted on the mobile module, the material storage cylinder is used for storing wafers, the grabbing module is used for grabbing the material storage cylinder, and the material storage cylinder is transmitted into the reaction bin from a material inlet door; wafers in the material storage cylinder are orderly placed into the number three reaction tank, the number two reaction tank and the number onereaction tank to be etched via cooperation with the grabbing module; finally the wafers in the material storage cylinder are taken out via the material outlet door; the wafer wet method etching systemis mainly used for etching the wafers and capable of improving usage efficiency of an etching liquid, the wafers can be etched in batch, and etching efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of wet etching, in particular to a wafer wet etching system. Background technique [0002] Various etching processes are often used in semiconductor manufacturing technology. Among them, the wet etching process is mainly an etching technology that uses a reaction solution to remove the etchant. Specifically, the chemical reaction between the reaction solution and the etchant is used to make the The etchant is partially released from the wafer surface, thus obtaining the desired surface on the wafer. However, mass production of wafers requires a large amount of etching solution, and if the utilization of the etching solution can be improved, the production cost can be increased. [0003] There are also some technical solutions for wet etching devices in the prior art. For example, a Chinese patent with application number 201420593668.7 discloses a wet etching device, which at least includes: an etching tank ...

AI Technical Summary

Problems solved by technology

Although this technical solution can prolong the service life of the etching tank, the technical solution cannot improve the use efficiency of the etching solution, resulting in a waste of cost. At the same time, the solution cannot realize batch automatic production; this invention is limited

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