A wafer ion implantation method

Abstract

The invention belongs to the technical field of semiconductor processing, in particular to a wafer ion implantation method. The etching device used in the method comprises a moving module, a grabbingmodule, a first reaction tank, a second reaction tank, a third reaction tank, and a storage barrel, wherein the first reaction tank, second reaction tank, and third reaction tank are fixedly mounted on the surface of the wall bottom in the reaction chamber; the moving module is fixedly mounted on the top of the side surface of the inner wall in the reaction chamber; the gripping module is mountedon the moving module, the storage barrel is used for storing the wafer; the gripping module is used for grasping the storage barrel that is transported from the feeding gate to the reaction chamber; and the moving module cooperates with the gripping module to place the wafer in the storage barrel sequentially in the third reaction tank, the second reaction tank and the first reaction tank for etching. The invention is mainly used for etching the wafer, which is capable of improving the use efficiency of the etching liquid, and improving the etching efficiency by performing batch etching on thewafer.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a wafer ion implantation method. Background technique [0002] In the semiconductor manufacturing process, whether the impurity tolerance of wafer ion implantation is uniform or not depends on the lithography process and cleaning process of the wafer. Among them, the cleaning process of the wafer plays a decisive role in the quality of the wafer. In semiconductor manufacturing technology, it is often Wet etching will be used mainly for leveling the wafer just after cutting, specifically through the chemical reaction between the reaction liquid and the etchant, so that the etchant is partially detached from the wafer surface, so that the wafer can be obtained the desired surface. However, mass production of wafers requires a large amount of etching solution, and if the utilization of the etching solution can be improved, the production cost can be increased. [...

AI Technical Summary

Problems solved by technology

Although this technical solution can prolong the service life of the etching tank, the technical solution cannot improve the use efficiency of the etching solution, resulting in a waste of cost. At the same time, the solution cannot realize batch automatic production; this invention is limited

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