A laminated structure of a laminated assembly, a preparation method thereof, and a laminated assembly
A technology of laminated structure and laminated assembly, applied in the direction of coating, electrical components, semiconductor devices, etc., can solve the problems of heavy packaging materials, poor lamination effect, cumbersome lamination process, etc., to reduce weight and improve Aesthetics, the effect of reducing installation costs
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Embodiment 1
[0058]Seefigure 2 As shown, a laminate structure of a lamination assembly includes a first package layer 11a, a laminated battery 13a, and a second package layer 14a, wherein the laminate comprises a fluorine-like film layer in order to further enhance weather resistance. The fluoroplastic film layer is located above the first package.
[0059]In the present embodiment, the lamination structure further includes a first encapsulating film layer 12a, and the first encapsulating film layer 12a is located between the first sealing layer 11a and the laminated battery 13a. The first encapsulated film layer 12a is made of an EVA material.
[0060]The first package layer is prepared from 30 parts by weight of the fiber cloth and 70 parts by weight of the first encapsulation powder coating, and the second package layer is prepared from 50 parts by weight of the fiber cloth and 50 parts by weight of the second package powder coating; the fiber cloth is The fibrous material is made of a flat fabric;...
Embodiment 2
[0078]Seeimage 3 As shown in the present embodiment, the lamination structure includes a fluorine plastic film layer 11b, a first package layer 12b, a first encapsulating film layer 13b, a laminated battery 14b, and a second sealing layer 15b, a fluoroplastic film layer 11b. The remaining technical scheme of the first release layer 12b is the same as those of the above-described Embodiment 1.
Embodiment 3
[0080]SeeFigure 4 In the present embodiment 3, the laminate includes a first package layer 11c, a first encapsulating film layer 12c, a laminated battery 13c, a second package layer 14c, and a back plate layer 15c, and the back plate layer 15c is located in the second Next, the other technical solution of the present embodiment 3 is the same as those of the above-described EXAMS.
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