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Method for extracting process parameters from microscopic image of back-drilled pcb section

A technology of cross-section microscopy and process parameters, which is applied in the direction of electrical connection formation of printed components, can solve problems such as visual fatigue, difficulty in measurement, rough hole walls, etc., achieve high degree of automation, improve measurement accuracy and speed, and achieve accurate results.

Active Publication Date: 2020-01-14
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The size inspection process is time-consuming and laborious, and the rough hole wall is difficult to measure, and it is easy to cause visual fatigue

Method used

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  • Method for extracting process parameters from microscopic image of back-drilled pcb section
  • Method for extracting process parameters from microscopic image of back-drilled pcb section
  • Method for extracting process parameters from microscopic image of back-drilled pcb section

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Embodiment

[0042] Aiming at the back-drilling of the PCB on the assembly line, high-definition microscopic images were taken through a microscope to obtain figure 1 As shown in the original image, the process parameter extraction method of the back-drilled PCB cross-section microscopic image described in this embodiment is to automatically extract and mark the corresponding parameters for the original image. For specific steps, see figure 2 .

[0043] 1. Filtering and grayscale conversion

[0044] According to the characteristics of the image, choose to smooth and denoise the image, and use Gaussian filter for filtering. Because the size of the image is large, which is 2800*1550, the size of the Gaussian kernel is (9, 9).

[0045] Convert the filtered color image to a grayscale image and convert it to a single-channel grayscale image.

[0046] 2. Threshold segmentation

[0047] Due to the large difference in gray scale between the copper sink area (copper section area) and the plate...

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Abstract

The invention discloses a process parameter extraction method of a back-drilled PCB cross section microscopic image. The process parameter extraction method comprises the steps of firstly, extractinga left profile and a right profile, constructing a hash array of the left profile taking the left profile as an example, recording the corresponding leftmost side point and the corresponding rightmostside point under a longitudinal coordinate in the profile, and obtaining parameters such as left-side width and left-side hole wall roughness of a resided hole ring according to point coordinate; andsecondly, seeking abrupt change part with left-side thickness from large to small of a hole copper wall by a neighborhood value optimization method, wherein the difference value between the abrupt change part and the maximum value of the longitudinal coordinate in the left profile is stub length. The invention also discloses extraction for process parameters such as right-side hole wall roughnessand right-side width of resided hole ring of the right profile. By the method, an interested region of the microscopic image can be partitioned, automatic calculation is performed according to inputproportion scale information, and physical parameter extraction efficiency and reliability of the back-drilled PCB cross section are improved.

Description

technical field [0001] The invention relates to the fields of PCB parameter measurement and image processing research, in particular to a process parameter extraction method of a back-drilled PCB cross-section microscopic image. Background technique [0002] In the manufacture of PCB boards, back drilling technology is a commonly used processing technology. Back drilling is a relatively special controlled depth drilling. Take the production of multi-layer boards as an example, such as 12-layer boards, it is necessary to connect the first layer to the ninth layer. The usual method is to drill a through hole at a time, and then sink copper. But then layer 1 will be directly connected to layer 12. And because there is no line that needs to be connected from the 10th layer to the 12th layer, there will be an extra copper column (called stub in the industry), which will affect the signal path and the integrity of the communication signal, especially for high-speed The integrit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 胡志辉周浔黄茜王尔琪
Owner SOUTH CHINA UNIV OF TECH