Terminal for semiconductor power device
A technology for power devices and semiconductors, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve the problems of reducing chip terminal characteristics and large electric field peaks.
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[0024] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar units are denoted by the same reference numerals.
[0025] Such as figure 1 As shown, the existing terminals for semiconductor power devices include a collector 11, a base region 12 (that is, a substrate), a plurality of field limiting rings 13, and a dielectric layer 14 arranged between the field limiting rings 13 and the field plates 15 As well as the field plate 15, the field confinement ring 13 is formed by two d...
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