Processing technology for preventing flexible board of rigid-flexible board from being bent and broken

A soft-rigid combination board and processing technology technology, which is applied in the direction of circuit bendable/stretchable parts, printed circuit parts, electrical components, etc. Effects of bending stress, improved quality and reliability

Inactive Publication Date: 2018-11-06
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The biggest feature of the soft-rigid board itself is to save assembly space, and it can be bent arbitrarily wh

Method used

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  • Processing technology for preventing flexible board of rigid-flexible board from being bent and broken
  • Processing technology for preventing flexible board of rigid-flexible board from being bent and broken
  • Processing technology for preventing flexible board of rigid-flexible board from being bent and broken

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: A processing technology for preventing the bending and fracture of the soft board of the soft-hard board, comprising the following steps:

[0029] (1) if figure 1 As shown, prepare the flexible board substrate, the model of the flexible board substrate is 0.002″H / H OZ, and the supplier is Kunshan Xinyang Electronic Materials Co., Ltd.; the flexible board layer substrate includes an upper copper surface 1, an insulating layer 2, a lower copper surface 3, and make circuits on the upper copper surface 1 and the lower copper surface 3 respectively;

[0030] (2) Make the cover film 4 for protecting the circuit of the flexible board, including the upper cover film 41 and the lower cover film 42, the model is FGA0525, and the supplier is Kuntaihong Electronic Materials Co., Ltd.; the size of the cover film 4 is bent than the flexible board The area is 1.27mm larger;

[0031] (3) if figure 2 As shown in , attach the prepared cover film to the soft board layer;...

Embodiment 2

[0039] Embodiment 2: A processing technology for preventing the bending and fracture of the soft board of the soft-hard board, comprising the following steps:

[0040] (1) if figure 1 As shown, prepare the flexible board substrate, the model of the flexible board substrate is 0.002″H / H OZ, and the supplier is Kunshan Xinyang Electronic Materials Co., Ltd.; the flexible board layer substrate includes an upper copper surface 1, an insulating layer 2, a lower copper surface 3, and make circuits on the upper copper surface 1 and the lower copper surface 3 respectively;

[0041] (2) Make the cover film 4 for protecting the circuit of the flexible board, including the upper cover film 41 and the lower cover film 42, the model is FGA0525, and the supplier is Kuntaihong Electronic Materials Co., Ltd.; the size of the cover film 4 is bent than the flexible board 1.5mm larger area;

[0042] (3) if figure 2 As shown in , attach the prepared cover film to the soft board layer;

[004...

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Abstract

The invention relates to a processing technology for preventing a flexible board of a rigid-flexible board from being bent and broken. The processing technology is characterized by comprising the following steps of (1) preparing a flexible board layer substrate; (2) fabricating a coverage film for protecting a flexible board circuit, wherein the coverage film comprises an upper-layer coverage filmand a lower-layer coverage film, the size of the coverage film is larger than that of a flexible board bending region by at least 0.5 millimeter, and a single edge is needed to extend into a rigid board region by at least 0.25 millimeter; (3) attaching the fabricated coverage film onto a flexible board layer; (4) sequentially arranging an upper copper foil, a second upper prepreg, an upper rigidboard layer, a first upper prepreg, the flexible board layer substrate, a first lower prepreg, a lower rigid board layer, a second lower prepreg and a lower copper foil from top to bottom according toa sequence, and performing lamination; and (5) producing according to the required process flow, and completing production of a product. By the processing technology, the rigid-flexible board can beprevented from being bent and broken, and the quality and the reliability of the product are improved.

Description

technical field [0001] The invention relates to a processing technology for preventing the bending and fracture of a soft board of a soft-hard combination board, and belongs to the technical field of printed circuit board processing. Background technique [0002] With the development trend of thinner, more integrated and multi-functional consumer electronic products, the requirements for the manufacturing process of printed circuit boards are getting higher and higher. Following this trend, rigid-flex printed circuit boards will gradually become an important part of printed circuit boards, and one type of rigid-flex printed circuit board with a cavity that can bury capacitance and resistance will also increase with market demand. Rigid-flex board, as the name implies, is one or more rigid printed circuit boards, including one or more flexible printed circuit boards that are indispensable to form a whole. Its function reduces the use of connectors when assembling electronic p...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0281H05K3/0044
Inventor 华福德张志敏
Owner GULTECH WUXI ELECTRONICS CO LTD
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