Method for preparing mask plate
A mask and mask technology, applied in the semiconductor field, can solve the problem of low wafer publishing efficiency, and achieve the effects of improving publishing efficiency, reducing the number of false positives, and reducing the time required for inspection
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[0030] The method for preparing the mask plate proposed by the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, the accompanying drawings are all in a very simplified form and in inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, each drawing needs to show different emphases, and sometimes different scales are used.
[0031] like figure 1 As shown, an embodiment of the present invention provides a method for preparing a mask.
[0032] First, step S01 is performed to provide an initial target graphic, the initial target graphic includes a first-layer graphic and a second-layer graphic, the first-layer graphic includes a plurality of structural graphics, and a plurality of the structu...
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