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Method for preparing mask plate

A mask and mask technology, applied in the semiconductor field, can solve the problem of low wafer publishing efficiency, and achieve the effects of improving publishing efficiency, reducing the number of false positives, and reducing the time required for inspection

Active Publication Date: 2018-11-13
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a reticle to solve the problem of low wafer publishing efficiency in the prior art

Method used

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  • Method for preparing mask plate
  • Method for preparing mask plate
  • Method for preparing mask plate

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Embodiment Construction

[0030] The preparation method of the reticle proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, each drawing needs to display different emphases, and sometimes uses different scales.

[0031] Such as figure 1 As shown, the embodiment of the present invention provides a method for preparing a mask.

[0032] First, step S01 is executed to provide an initial target graphic, the initial target graphic includes a first layer graphic and a second layer graphic, the first layer graphic includes a plurality of structural graphics, a plurality of the structures are arran...

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Abstract

The invention provides a method for preparing a mask plate. According to the method, a first layer of graphics of a second layer of graphics of covered parts in initial target graphics are classifiedinto a first type of graphics and a second type of graphics according to a design rule of graphics before correcting the second layer of graphics in the initial target graphics with an existing optical proximity correction model; inspection specifications are respectively set for the first type of graphics and the second type of graphics to reduce the number of false positives when simulation software is utilized to inspect correction results, thereby reducing the time required for inspection and improving the final publishing efficiency of wafers.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for preparing a mask. Background technique [0002] Photolithography technology is the driving force for the development of integrated circuit manufacturing technology, and it is also one of the most complex technologies. The improvement of lithography technology is of great significance to the development of integrated circuits. Before the lithography process starts, it is first necessary to copy the design pattern onto the mask plate through specific equipment, and then use the lithography equipment to generate light of a specific wavelength to copy the pattern structure on the mask plate to the wafer for chip production. However, due to the optical proximity effect (Opticle Proximity Effect, OPE), the actual pattern copied to the wafer after the design pattern is exposed will produce deviations. In order to avoid this problem, optical proximity correction (Opt...

Claims

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Application Information

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IPC IPC(8): G03F1/36
CPCG03F1/36
Inventor 储志浩顾婷婷
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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