Method for fixing electronic component on PCB and finishing welding

Abstract

The invention discloses a method for fixing an electronic component on a PCB and finishing welding. An electronic component positioning block 1 and a PCB 2 are included, and at least one electronic component insertion through hole 11 matched with the electronic component to be welded at a designated solder paste contact of the PCB is formed in the top of the electronic component positioning block1. The welding method comprises the steps as follows: positioning, insertion of the electronic component, putting in a furnace, cooling and forming. The method has the advantages that the electronic component can be completely prevented from being broken (damaged), the welding quality is greatly improved, the reject ratio is almost zero, the production efficiency is obviously improved, pins of thewelded electronic component and solder paste are firmly connected, the pins of the welded electronic component are welded in the center, and the production cost is greatly reduced and the like.

Description

technical field [0001] The invention relates to a process for welding electronic components to a PCB circuit board, in particular to a method for fixing electronic components on a PCB circuit board and completing welding. Background technique [0002] At present, the large-scale mass-produced circuit boards basically use the placement machine to glue the electronic components to the tin contacts at the designated positions, and then heat the solder paste to reach the melting point and then bond with the electronic components. The feet are welded together, and then the temperature is lowered to solidify the solder paste to complete the welding of the electronic components and the PCB circuit board. However, the pressure caused by the difference in the amount of solder on the contacts of the PCB circuit board will cause some electronic components to break (damage) ), the welding quality cannot be seen intuitively, for example: there are bubbles in the solder paste, unmelted, o...

AI Technical Summary

Problems solved by technology

[0002] At present, the large-scale mass-produced circuit boards basically use the placement machine to glue the electronic components to the tin contacts at the designated positions, and then heat the solder paste to reach the melting point and then bond with the electronic components. The feet are welded as one, and then the temperature is lowered to solidify the solder paste to complete the welding of the electronic components and the PCB circuit board. However, the pressure caused by the difference in the amount of solder on the contacts of the PCB circuit board will cause some electronic components to break (damage) ), the welding quality cannot be seen intuitively, for example: there are bubbles in the solder paste, unmelted, offset contacts of the feet of electronic components, etc.; in addition, not all electronic components can be soldered by placement machines, some vertical Or larger electronic components need to be manually welded, the labor cost is high, the production efficiency is low, and manual welding of electronic components that require some positive and negative electrodes will cause reverse welding of the positive and negative electrodes, and the product qualification rate is difficult to guarantee; The cost of SMT electronic components dedicated to SMT is high

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