Assembled circuit board inspection system and assembled circuit board inspection method

Abstract

An assembly circuit board detection system includes a detection platform, a camera device, a pressing board and a computing host. The detection platform has a carrying surface for placing the assembled circuit board, and the carrying surface has a plurality of circuit detection contacts. The camera device photographs the assembled circuit board on the carrying surface to generate an image to be tested. The pressing plate is movably arranged between the detection platform and the camera device. The pressing plate has a light-transmitting part opposite to the camera device. The pressing plate is used to press against the assembled circuit board to make the pins of the multiple materials of the assembled circuit board Electrically connected to the detection contact of the circuit. The computer is electrically connected to the testing platform and the camera device to receive the image to be tested and execute the image analysis program, and to perform material testing on the assembled circuit board through the testing platform.

Description

technical field [0001] The present invention relates to an assembled circuit board inspection system and an assembled circuit board inspection method, in particular to an assembled circuit board inspection system integrating Automated-Optical Inspection (AOI) and In Circuit Tester (ICT) And the detection method of assembled circuit board. Background technique [0002] In the process of manufacturing electronic products, various electronic components must be assembled on a printed circuit board (PCB). These electronic components can usually adopt surface mount technology (Surface Mount Technology, SMT) or dual in-line package (Dual In Line Package, DIP) technology. Among them, the assembly method of DIP process parts is to insert the pins of DIP parts into the plating through hole (PTH) on the printed circuit board, and apply flux on the bottom of the printed circuit board, and then solder the parts through the solder furnace. It is fixed on the printed circuit board, and t...

AI Technical Summary

Problems solved by technology

However, due to the current situation that the hardware equipment of the test machine is individually set independently, the test items that can theoretically be processed at the same time must be divided into multiple stations to carry out sequentially, resulting in an extremely long total test time for a single assembled circuit board and inefficient

In addition, due to the large number of DIP parts on the assembled circuit board, the operator who cooperates with the test machine is prone to make mistakes in the visual inspection process due to factors such as negligence and fatigue, resulting in the failure of the assembled circuit board to maintain a stable yield rate, and therefore additional Increase the cost of rework after the test goes wrong

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