Method for manufacturing lamp filament structure
A manufacturing method and filament technology, applied to semiconductor devices of light-emitting elements, lighting devices, light sources, etc., can solve the problems of unbalanced light-emitting angles of light-emitting bodies, incomplete overall structural design, and unbalanced light-emitting angles, etc., to save raw materials , Facilitate mechanical automation and high production efficiency
Inactive Publication Date: 2018-11-16
HANGZHOUSIJUNSITECHCOLTD
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Problems solved by technology
Even if a three-dimensional luminous body is formed by one or more substrates, due to the incomplete design of the overall structure, it is also easy to have unbalanced lighting angles in the luminous body
In addition, when the substrate is a light-transmitting material, although it can emit light in 360 degrees, they usually encounter heat dissipation problems
On the contrary, when the substrate is an opaque material, such as metal, there will be no light on the side where the LED chip is not installed, resulting in no 360-degree light emission
Method used
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[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0028] Such as Figure 1-3 Shown is the filament structure of the embodiment of the present invention, the schematic diagram of the bulb, the filament structure, such as figure 1 , 2 As shown, at least three filament substrates 1 are included. The at least three filament substrates 1 include a first end and a second end. power supply. The filament substrate 1 extends between a first end and a second end. Each of the at least three filament substrates 1 rotates and extends around an axis, and the rotation angle of the second end of the filament substrate relative to the first end does not exceed 720 degrees. Preferably, the axes around which the at least three filament substrates 1 are coincident, that is, all rotate around the same axis, or the axes around which the at least three filament substrates 1 are parallel to each other, or form a...
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The technical scheme of the invention mainly relates to a method for manufacturing a lamp filament structure. The method comprises the following steps that 1, at least three lamp filament substrates are arranged in the same plane, wherein each lamp filament substrate comprises a first end and a second end, the lamp filament substrates separately rotate around a point between the first ends and thesecond ends for extension, and the angle of the second ends of the lamp filament substrates rotating around the point is not greater than 720 degrees with respect to the first ends; 2, the first endsand second ends of the lamp filament substrates are stretched to a plane with phase separation, and at the same time, the lamp filament substrates form a three-dimensional structure which rotates around the axis between the first ends and the second ends. According to the method for manufacturing the lamp filament structure, not only is the method simple, convenience is provided for mass production, the production efficiency is high, but also less waste is generated, and raw materials are saved. In addition, the manufactured lamp filament structure is convenient to machine and install, multi-angle omnidirectional illumination can be achieved, and the heat dissipation efficiency can also be taken into account.
Description
technical field [0001] The invention relates to an LED lighting device, in particular to a method for manufacturing an LED filament structure. Background technique [0002] As a new light source, LED has been more and more widely used in household and commercial lighting, and has gradually become a commonly used light source in people's life. However, the LED light source has the characteristics of high directivity and high heat generation, so it is difficult to apply it to a small-sized light bulb. In order to obtain all-round lighting, more LED light-emitting elements must be installed, and the more LED light-emitting elements, the larger the volume required for heat dissipation. Restrictions, either larger in size or lower in brightness. [0003] In the prior art, there are different LED packaging methods, including lead type (Lamp) LED packaging, chip on board (Chip On Board) LED packaging, SMD (Surface Mount Device) LED packaging, system type (System InPackage) LED p...
Claims
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Inventor 葛铁汉
Owner HANGZHOUSIJUNSITECHCOLTD