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micro module

A technology of micro-modules and sub-modules, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment construction parts, etc., can solve the problems of insufficient internal layout, large-scale deployment and waste of land resources, etc., and achieve efficient operation and maintenance , high installation efficiency, and the effect of saving land resources

Active Publication Date: 2020-07-10
CHINA MOBILE GROUP DESIGN INST +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, most of the micro-module forms that have been promoted and used in the industry are single-layer and single-connected. Multiple micro-modules are spliced ​​at the same level, and the internal layout is not compact enough. Large-scale deployment is a waste of land resources.

Method used

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Embodiment Construction

[0050] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0051] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

[0052] The invention re...

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Abstract

The invention relates to the field of data centers and discloses a micromodule. The micromodule comprises a frame system and submodules arranged in the frame system, wherein the frame system comprisesat least two layers of frames; each layer of frame is provided with at least two submodules; each submodule comprises two columns of cabinets; each layer of frame forms a cold channel between two columns of cabinets of each submodule; and heat channels are formed in two outer sides of each submodule, wherein corresponding sides of the adjacent submodules share the same heat channel. According tothe micromodule, at least two layers of micromodules are assembled, and meanwhile, reasonable layout is carried out on the inside, so that the installation efficiency is higher and more land resourcesare saved in large-scale application; and the corresponding sides of the adjacent submodules share the same heat channel, so that the cold channels and the heat channels are reasonable in size and layout, and efficient operation and maintenance in the module can be achieved.

Description

technical field [0001] The invention relates to the field of data centers, in particular to a data center micromodule. Background technique [0002] Driven by cloud computing and big data applications, the construction of data centers has ushered in a new construction climax. Facing such a huge market, traditional data centers are "solid", lacking flexibility and scalability. [0003] The micro-module data center divides the data center site into micro-modules according to industry standards, that is, the entire data center is divided into several independent areas, and the scale, power load, and configuration of each area are designed according to uniform standards. [0004] Because the micro-module can be quickly deployed and constructed in stages, and cooperate with the intelligent management and control system to achieve the effect of green energy saving, it brings a series of advantages to the micro-module data center. [0005] However, most of the micro-module forms t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145
Inventor 刘洪朱丽张彦遒李鸿飞娄小军罗永强尹朝辉董聪聪黎学超陈旭赵昱李震董磊王铁成陈鸣飞吴文静孙丽玫吴志昂
Owner CHINA MOBILE GROUP DESIGN INST
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