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Broken wire monitoring structure and monitoring method for photovoltaic silicon wafer cutting machine

A technology for cutting machines and silicon wafers, applied in photovoltaic power generation, stone processing equipment, electrical components, etc., to achieve the effect of easy intervention

Pending Publication Date: 2018-11-23
CHANGZHOU INST OF MECHATRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first purpose of the present invention is to provide a disconnection monitoring structure of a photovoltaic silicon wafer cutting machine to solve the technical problem of simple structure and low-cost photovoltaic silicon wafer cutting machine disconnection monitoring
[0005] The second purpose of the present invention is to provide a disconnection monitoring method for a photovoltaic silicon wafer cutting machine to solve the technical problem of simple structure and low-cost photovoltaic silicon wafer cutting machine disconnection monitoring

Method used

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  • Broken wire monitoring structure and monitoring method for photovoltaic silicon wafer cutting machine
  • Broken wire monitoring structure and monitoring method for photovoltaic silicon wafer cutting machine
  • Broken wire monitoring structure and monitoring method for photovoltaic silicon wafer cutting machine

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Embodiment 1

[0035] See figure 1 with figure 2 As shown, this embodiment provides a disconnection monitoring structure of a photovoltaic silicon wafer cutting machine, which is suitable for monitoring the disconnection status of a photovoltaic silicon wafer cutting machine in the diamond wire cutting mode, and includes a detection wire 600 and a monitoring module. The photovoltaic silicon wafer cutting machine is driven by a frequency converter to drive a three-phase AC asynchronous motor. The driving wheel 300 is driven by a coupling. The diamond wire 200 is cut through the guide wheel 400 and the automatic tensioning wheel 500 is under the action of a predetermined and adjustable tension. The silicon wafer 100 to be processed is cut at a high speed. When the cutting diamond wire 200 is broken, the tension wheel 500 loses its balance due to the force and drops.

[0036] The detection wire 600 includes a section of bare wire 602; the bare wire 602 is located directly below the tension wheel 5...

Embodiment 2

[0048] This embodiment provides a method for monitoring wire breakage of a photovoltaic silicon wafer cutting machine, including:

[0049] Step S1: The detection wire 600 is suitable for contacting the tension wheel 500 of the diamond wire cutting transmission mechanism of the photovoltaic silicon wafer cutting machine to ground the detection wire 600; wherein, the detection wire 600 is in a normally energized state.

[0050] Step S2: The micro-processing unit learns the connection state between the first detection terminal and the second detection terminal connected to the detection wire 600.

[0051] The micro-processing unit is connected with a control signal output unit and a status indicator; the control signal output unit is suitable for controlling the driving wheel frequency converter of the diamond wire cutting transmission mechanism to quickly stop and / or the alarm signal light of the photovoltaic silicon wafer cutting machine is on. Specifically, when the cutting diamond w...

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Abstract

The invention discloses a broken wire monitoring structure and a monitoring method for a photovoltaic silicon wafer cutting machine, comprising a detecting wire and a monitoring module. The detectingwire comprises a bare wire, wherein the bare wire is located directly under a tensioning wheel of a diamond wire cutting transmission mechanism of the photovoltaic silicon wafer cutting machine, so asto be suitable for contacting the bare wire when a diamond wire is broken and the tensioning wheel is falling to make the detecting wire grounded. The monitoring module comprises a first detecting terminal and a second detecting terminal connected by the detecting wire, and a micro processing unit connected to the first detecting terminal and the second detecting terminal, that is, a connection state of the first detecting terminal and the second detecting terminal is obtained by the micro processing unit.

Description

Technical field [0001] The invention relates to the technical field of photovoltaic silicon wafer processing, in particular to a monitoring structure and a monitoring method for disconnection of a photovoltaic silicon wafer cutting machine. Background technique [0002] Solar energy is a kind of green energy that exists widely in nature. Solar power generation and solar heating are the two main directions of solar energy utilization. The production of solar wafers is the core technology of solar energy conversion, and my country is the world's largest producer of solar wafers , But the production lines of silicon wafers are basically imported products, and the cost is relatively high. The production of silicon wafers is inseparable from the two forms of diamond wire cutting or laser cutting. Among them, diamond wire cutting is widely used. There will inevitably be a certain probability of wire breakage during the cutting process. It is necessary to conduct accurate and timely dete...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00H01L31/18
CPCH01L31/1804B28D5/042B28D7/00Y02E10/547Y02P70/50
Inventor 潘天堂陈新王辰于晓栋
Owner CHANGZHOU INST OF MECHATRONIC TECH
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