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Semiconductor packaging device

A packaging equipment and semiconductor technology, applied in packaging, packaging protection, transportation and packaging, etc., can solve the problems of semiconductor difficulty, low efficiency, and no automation of semiconductor tape packaging.

Inactive Publication Date: 2018-11-23
王加骇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shortcomings of the existing semiconductor packaging equipment are: 1. It is difficult and inefficient for the manipulator to take the semiconductor directly from the material tube; 2. After the semiconductor is put into the carrier tape, the process of laminating the cover tape is required to complete the semiconductor packaging. Equipment operation is not fully automated for semiconductor tape packaging

Method used

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  • Semiconductor packaging device
  • Semiconductor packaging device
  • Semiconductor packaging device

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] like Figure 1-11 The semiconductor packaging equipment shown includes a frame 1 and a semiconductor feeding device 2 on it, a semiconductor handling device 3, a carrier tape conveying device 4, a CCD visual inspection device 5, a cover tape conveying device 6, and a compression sealing device 7 and control unit 8.

[0025] The semiconductor feeding device 2 is installed on the frame 1 at an inclination angle of 45 degrees, and the semiconductor feeding device 2 is used for semiconductor feeding; the semiconductor handling device 3 is fixedly arranged on the frame 1, and the semiconductor feeding device 2 and the carrier belt conveying device 4 Connected by the semiconductor handling device 3, the semiconductor handling device 3 is used to transport the semiconductor from the semiconductor feeding device 2 to the carrier tape conveying device 4;...

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PUM

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Abstract

The invention relates to the technical field of semiconductor production. A semiconductor packaging device comprises a rack, a semiconductor feeding device, a semiconductor carrying device, a carryingbelt conveying device, a CCD visual detection device, a cover belt conveying device and a pressing sealing device, wherein the semiconductor feeding device, the semiconductor carrying device, the carrying belt conveying device, the CCD visual detection device, the cover belt conveying device and the pressing sealing device are arranged on the rack. The semiconductor packaging device has the beneficial effects that a semiconductor, a carrying belt and a cover belt are conveyed stably, the machining efficiency is high, and packaging of the semiconductor is completed in a full automatic manner.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to semiconductor tape packaging equipment. Background technique [0002] At present, the semiconductor industry usually uses tape packaging machines for product packaging. The traditional semiconductor discharging method is vibrating plate discharging, which has the disadvantages that the discharging method is unstable and easy to damage semiconductor components. The existing semiconductor packaging equipment is as described in the fully automatic tape packaging machine with the Chinese patent publication number CN206255236, which includes a frame assembly, a storage assembly for placing components, and a tape assembly for winding the carrier tape. and a take-out assembly for placing components into the carrier tape. After the semiconductor processing is completed, it is generally placed in a row in the material tube. The shortcomings of the existing semiconducto...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B15/04B65B57/10
CPCB65B15/04B65B57/10
Inventor 王加骇
Owner 王加骇