Liquid crystal display panel

Abstract

The invention provides a liquid crystal display panel. The liquid crystal display panel comprises an array substrate and a color film substrate which is opposite to the array substrate; the array substrate comprises a first area and second areas, and the second areas are arranged on at least one side of the first area. The first area is internally provided with a thin film transistor array; the color film substrate is correspondingly arranged in the first area. The ends of the second areas are each provided with at least one alignment mark, and the alignment marks are electrically connected with a common electrode of the thin film transistor array, wherein the alignment marks are silver glue point marks, and the alignment marks can be used for Cell section alignment. The alignment marks onthe liquid crystal display panel replace alignment marks and silver glue point marks of an existing liquid crystal box, space in an OLB area is saved, effective external circuit connection is facilitated, and the quality of the liquid crystal display panel is improved.

Description

technical field [0001] The invention relates to a display panel, in particular to a liquid crystal display panel. Background technique [0002] The display area of ​​current mobile display screens tends to be larger and larger, which compresses the area of ​​the Outer Lead Bonding (OLB, outer lead crimping) area in the LCD panel, which is especially unfavorable for Chip on Glass (COG, fixing the chip on the glass) Substrate) This driving circuit packaging method. At present, the product has a Cell alignment mark and a silver glue point mark on the left and right sides of the Border under the TFT Panel, and the two are placed adjacent to each other; the Cell alignment mark is a solid cross mark; the center of the silver glue point is another cross mark; thus, The liquid crystal cell alignment mark and the silver glue dot mark in the binding area are set separately, which wastes a lot of space in the OLB area, which is not conducive to effective external circuit connection, a...

AI Technical Summary

Problems solved by technology

[0002] The display area of ​​current mobile display screens tends to be larger and larger, which compresses the area of ​​the Outer Lead Bonding (OLB, outer lead crimping) area in the LCD panel, which is especially unfavorable for Chip on Glass (COG, fixing the chip on the glass) Substrate) This driving circuit packaging method

At present, the product has a Cell alignment mark and a silver glue point mark on the left and right sides of the Border under the TFT Panel, and the two are placed adjacent to each other; the Cell alignment mark is a solid cross mark; the center of the silver glue point is another cross mark; thus, The liquid crystal cell alignment mark and the silver glue dot mark in the binding area are set separately in position, which wastes a lot of space in the OLB area, which is not conducive to effective external circuit connection, and further affects the quality of the display panel

Images