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A method for preparing uniform surface microstructure by embossing ultra-thin materials
Active Publication Date: 2021-03-16
WUHAN UNIV
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[0008] The present invention effectively solves the problem of non-uniform microstructure of the prepared surface due to the inevitable surface roughness of nano-imprinted ultra-thin materials by introducing a pressure-transmitting layer. The thickness of the pressure transmission layer is greater than the surface roughness of the material in contact with it, and its formability is not inferior to that of stamped metal under stamping conditions, so that the rheology of the pressure transmission layer can effectively fill the surface of the material in contact with it Micro pits form a seamless integrated structure, and the pressure of the loading device can be evenly transmitted to the imprinted metal material, so that the imprinted metal flows into the holes of the mold to form a uniform surface microstructure
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Embodiment 1
[0037] A method for preparing uniform graphene / copper nanocolumn arrays on the surface of ultrathin graphene / copper foil, comprising the following steps:
[0038] (1) Select metal aluminum as the pressure transfer layer according to the preset embossing temperature of 480°C;
[0039] (2) From bottom to top, stack a 40 μm thick stainless steel substrate, an anodized aluminum oxide (AAO) mold layer with a pore size of 200 nm, a 34 μm thick copper foil covered with graphene, a 200 μm thick aluminum pressure transmission layer, and a 40 μm thick stainless steel base;
[0040] (3) Place the stack as a whole on the flat surface fixture of the universal testing machine and heat it to stabilize the temperature at 480°C (the flat surface fixture is heated by resistance wire, and its temperature can be precisely adjusted. If there is no special instruction, the following examples also Adopt this universal testing machine to carry out hot pressing);
[0041](4) Load the laminate to 15k...
Embodiment 2
[0044] A method for preparing a uniform nanocolumn array on the surface of gold foil, comprising the following steps:
[0045] (1) According to the embossing temperature of 500°C, metal aluminum is selected as the pressure transfer layer;
[0046] (2) Place a 40μm thick stainless steel substrate, an AAO mold layer with a pore size of 200nm, a 18μm thick gold foil, a 200μm thick aluminum pressure transmission layer, and a 40μm thick stainless steel substrate from bottom to top;
[0047] (3) Place the stack as a whole on the flat surface fixture of the universal testing machine to heat and stabilize the temperature at 500°C.
[0048] (4) At a constant temperature of 500°C, by controlling two parallel flat surface fixtures of the universal testing machine to move towards each other at a speed of 100N / s, a load is applied to the laminated system. When the load reaches 15kN (corresponding to a pressure of about 200MPa) for force holding for 400s; the 18μm thick gold foil plastical...
Embodiment 3
[0055] SEM test
[0056] figure 2 (a) with image 3 (a) By comparison, it is found that the former forms a relatively complete microstructure, while the latter has defects in its microstructure and is only a copy of the local microstructure. figure 2 (b) with image 3 (b) By comparison, it is found that the surface of the former is uniform and complete, while the latter has more obvious fracture marks. figure 2 (c) with image 3 (c) By comparison, it is found that the former obtains a graphene / copper nanopillar array with better uniformity and a large area, while the latter only has a nanopillar array in a small area.
[0057] Figure 4 (a) with Figure 5 (a) By comparison, it is found that the former forms a relatively complete microstructure, while the latter has defects in its microstructure and is only a copy of the local microstructure. Figure 4 (b) with Figure 5 (b) By comparison, it is found that the surface of the former is uniform and complete, while the ...
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Abstract
The invention discloses a method for preparing a uniform-surface micro-structure by an imprinted ultrathin material. The method comprises the following steps: (A) sequentially stacking a mold, an ultrafine material and a pressure transmission layer to form a sandwich structure; (B) heating the sandwich structure, and reducing the thickness of the sandwich structure with a loading device; and (C) removing the pressurized mold in the sandwich structure so as to form a duplicated uniform micro-structure on the surface of the ultrafine material. The method has the beneficial effects that, the imprinting process has a stable integral structure due to the design of the sandwich structure, high temperature operation is facilitated, and the compatibility of an existing nano-imprinting process is ensured; the geometrical limitation on an imprinted material in the existing nano-imprinting process can be greatly improved by introducing the pressure transmission layer, and the application range ofnano-imprinting, especially in the field of flexible devices, can be greatly expanded; the material is uniformly stressed in the imprinting process, and can be integrally duplicated; and the processis simple, strong in controllability and low in cost.
Description
technical field [0001] The invention relates to a method for preparing a uniform surface microstructure of an ultra-thin material. Background technique [0002] Flexible electronics are generally products that integrate multiple devices on the surface of thin-layer materials to obtain specific functions. Due to its low energy consumption and portability, flexible electronics has attracted great attention from the scientific and industrial circles in recent years. One of its core technologies is to realize the surface patterning of thin film materials. [0003] Nanoimprint technology is an important way to achieve high-precision surface patterning of materials. Sub-wavelength devices, nano-electronic devices, nano-integrated circuits, quantum memory devices, photonic crystal arrays, and OLED flat-layer display arrays are widely used in various fields such as military, communication, industry, and automobiles. [0004] Nanoimprint technology was first proposed by Professor Z...
Claims
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