A cob optical module automatic coupling dispensing and curing device

Abstract

The invention provides a chip on board (COB) light module autocoupling glue dispensing and solidifying device. The device comprises a support base, one or more first clamping mechanisms, one or more second clamping mechanisms, a glue dispensing mechanism and a heating mechanism. Each first clamping mechanism comprises a preliminary location structure and a locking structure. Each second clamping mechanism comprises a clamping structure and a feeding structure. Preliminary location is conducted on a chip by the preliminary location structures. The chip is locked by the locking structures afterpreliminary location is conducted on the chip by the preliminary location structures. The clamping structures are used for clamping lenses fixed to the chip through glue dispensing. The lenses clampedby the clamping structures are conveyed to preset positions by the feeding structures. Glue dispensing is conducted by a glue dispensing structure after the lenses are conveyed to the preset positions. Glue body in the contacting areas of the chip and the lenses is heated and solidified by the heating structure, and the chip and the lenses are integrated.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a COB optical module automatic coupling dispensing and curing device. Background technique [0002] In the prior art, since the packaging of electrical devices needs to be accurate and firm when the chip is packaged, it needs to be carried out in an environment with a uniform light source. At the same time, since multiple electrical devices need to be packaged during chip packaging, that is, It is necessary to fix the chip. The usual method is to use a pressure plate and bolts to fix the chip, and then implement packaging. Further, in order to improve the stability of the package, the chip is usually fixed at multiple points, which increases the chip before and after packaging. The process greatly reduces the packaging efficiency of the chip, and at the same time increases the work intensity of the operator. [0003] For this reason, it is necessary to provide a COB optic...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, since the packaging of electrical devices needs to be accurate and firm when the chip is packaged, it needs to be carried out in an environment with a uniform light source. At the same time, since multiple electrical devices need to be packaged during chip packaging, that is, It is necessary to fix the chip. The usual method is to use a pressure plate and bolts to fix the chip, and then implement packaging. Further, in order to improve the stability of the package, the chip is usually fixed at multiple points, which increases the chip before and after packaging. The process greatly reduces the packaging efficiency of the chip, and at the same time increases the work intensity of the operator

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