Single bimetal sheet packaging structure and packaging method thereof

Abstract

The invention discloses a single bimetal sheet packaging structure and a packaging method thereof. The single bimetal sheet packaging structure comprises a first circuit layer, a second circuit layer,a first solder mask layer, an upper metal plate, injection molding holes, first chips and / or second chips, third chips, solder balls and injection molding materials. The second circuit layer is electrically connected to the upper portion of the first circuit layer, and one or more cavities are formed by the second circuit layer and the first circuit layer; the first solder mask layer is arrangedon the lower portion of the first circuit layer in an overlapped mode and provided with a plurality of windowing areas; the upper metal plate is arranged in a mode of corresponding to the outer wall face of the second circuit layer; the injection molding holes communicate with the interiors of the cavities; the first chips and / or the second chips are located in the cavities, and the third chips are located outside the cavities; the solder balls are implanted into the windowing areas of the first solder mask layer so as to communicate with the first circuit layer; and the cavities and the injection molding holes are filled with the injection molding materials, and the third chips and the outer wall face of the second circuit layer are enveloped by the injection molding materials. Accordingto the single bimetal sheet packaging structure and the packaging method thereof, bimetal sheets are adopted to be packaged, so that circuits are connected to the surfaces or the interiors of the injection molding materials, accordingly, stacking packaging is achieved more conveniently, a mold with a mold cavity does not need to be adopted for plastic package, and the manufacturing cost is saved.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a single bimetal plate packaging structure and a packaging method. Background technique [0002] With the trend of multi-function and miniaturization of electronic products, high-density microelectronic assembly technology has gradually become the mainstream in the new generation of electronic products. In order to cooperate with the development of a new generation of electronic products, especially the development of smart phones, handheld computers, ultrabooks and other products, the packaging of integrated circuits is also developing in the direction of miniaturization, high density, high power, and high speed, and stacked packaging is exactly Developed in response to its high-density needs. [0003] POP package is a typical semiconductor stack package. In the field of logic circuits and memory, it has been the first choice in the industry. It is mainly ...

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Problems solved by technology

[0004] However, in the above-mentioned method, in the existing POP manufacturing process, it is necessary to groove the plastic package and form interconnection solder balls by solder printing, the manufacturing process is complicated, and the cost is relatively high.

[0005] PiP package is also a very typical semiconductor stacked package. It stacks multiple semiconductor chips in a single package to achieve the purpose of miniaturization and high density. However, when several semiconductor chips are stacked, the upper chip often requires It is smaller than the lower chip, otherwise the upper chip will be pressed to the bonding wire on the lower chip, which will affect the signal transmission of the lower chip

In order to solve this problem, the industry has proposed a stacked package in which copper pillars are set on the substrate to realize the support and signal transmission of the upper chip. However, this structure has relatively high requirements for the upper chip and can only be flip chip, and its Copper pillars with a certain height must be electroplated on the substrate first during manufacture, the manufacturing procedure is more complicated and the production cost is higher

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