Conductive silver paste for LTCC ceramic substrate and preparation method thereof

A technology of conductive silver paste and ceramic substrate, which is used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. Equal issues, to achieve the effect of eliminating the risk of electrical breakdown, good matching, good solder resistance

Active Publication Date: 2018-12-07
华昇电子材料(无锡)有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

This not only leads to the high cost of LTCC devices developed and produced in my country, but more importantly, the core key technologies and products are controlled by others, which seriously hinders the upgrading and development of my country's electronic paste technology and industry
[0004] LTCC technology In order to reduce the sintering temperature, LTCC ceramics are usually realized by doping low-melting point oxides or low-melting point glass. The complex system makes it difficult for traditional silver paste to match it, and even cannot meet the basic requirements for use.
During the co-firing process of traditional conductive silver paste and LTCC ceramic substrate, due to the differences in th

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  • Conductive silver paste for LTCC ceramic substrate and preparation method thereof

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[0031] The present invention also discloses the preparation method of the above-mentioned conductive silver paste for LTCC ceramic substrate, including:

[0032] (1) The polymer resin and the solvent are mixed according to a certain ratio and fully dissolved to obtain an organic vehicle. According to the formula, a certain proportion of polymer resin and solvent is dissolved at a certain temperature of 80°C-85°C for 1-2 hours to form a uniform and transparent fluid with a certain viscosity, which is an organic carrier.

[0033] In the present invention, the preparation of the organic carrier can be prepared by conventional methods in the field, for example, the following steps can be included: drying the polymer resin: placing the polymer resin in an oven at a constant temperature of 60°C-65°C for 8 -9 hours, so that the polymer resin is fully dried; the polymer resin and the solvent are mixed according to the proportion and fully dissolved to obtain the mixture: put the conta...

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Abstract

The present invention provides a conductive silver paste for LTCC (Low Temperature Co-fired Ceramic) ceramic substrate. According to the mass percent, the conductive silver paste is formed by 82%-86%of silver powder, 3%-4% of polymer resin, 0.2%-1.1% of glass powder and 10%-15% of solvent. The polymer resin is formed by ethyecellulose, carboxymethylcellulose and polyaspartic acid. The conductivesilver paste obtained by employing the preparation method provided by the invention is good in conductivity, high in adhesive force, and smooth and dense in appearance. The bonding force of the sliverlayer and the ceramic interface is high, and the internal portion of the device cannot generate cracking and delamination.

Description

technical field [0001] The invention relates to the technical field of conductive paste, in particular to a conductive silver paste suitable for LTCC ceramic substrates and a preparation method thereof. Background technique [0002] Communication, automotive, medical, military, aerospace and other applications require high performance, high density, and high reliability of electronic systems are and will continue to pose new challenges to electronic packaging. LTCC (Low Temperature Co-fired Ceramic) technology, low temperature co-fired ceramic technology, is an advanced passive integration and hybrid circuit packaging technology, which can integrate three passive components (including resistors, capacitors and inductors) And its various passive components (such as filters, transformers, etc.) are packaged in multilayer wiring substrates, and are integrated with active devices (such as: power MOS, transistors, IC circuit modules, etc.) into a complete circuit system. Low-tem...

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 陈立桥
Owner 华昇电子材料(无锡)有限公司
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