A kind of preparation method of zinc oxide thin film transistor
A zinc oxide thin film and transistor technology, applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of poor electrical stability, low on-state current, etc., achieve high on-state current, low cost, and simple preparation process Effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2019-07-30
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of semiconductor device preparation, and in particular relates to a preparation method of a thin film transistor. Background technique
[0002] With the advent of the information age, the display field has entered the era of flat-panel display. As the core component of AMLCD and AMOLED, thin-film transistors have become an irreplaceable leading technology in the flat-panel display industry. The stability of thin-film transistors and various performance indicators The height of the display will directly limit the imaging capability of the display. Especially for large-size, high-resolution, high-frame-rate displays, such as three-dimensional displays, the requirements for the stability and driving force of thin-film transistors are more stringent, and the hydrogenated amorphous silicon thin-film transistors commonly used in the market can no longer meet the requirements. . In addition, since the driving mod...
Examples
Embodiment Construction
[0079] Include the following steps:
[0080] (1), clean the substrate 1, the substrate 1 adopts a hard substrate or a flexible substrate, and the substrate of this embodiment adopts glass; the specific steps are as follows:
[0081] (1) First put the substrate 1 into an acetone solution, and ultrasonically clean it at room temperature for 3 to 5 minutes to remove surface molecular contamination;
[0082] (2) Place the substrate 1 treated in step (1) in an ethanol solution, and ultrasonically clean it at room temperature for 3 to 5 minutes to remove residual acetone on the surface;
[0083] (3) Ultrasonic cleaning the substrate 1 treated in step (2) with deionized water at room temperature for 3 to 5 minutes to remove residual ethanol and ionic contamination;
[0084] (4) Dry the substrate 1 treated in step (3) with high-purity nitrogen, and put it in an oven for 5 minutes at 90°C, see figure 1 ;
[0085] (2) Deposition of the gate 2, the gate material is a metal or oxide co...