Easy-to-maintain liquid immersion cooling switch

Abstract

The invention relates to an easy-to-maintain liquid immersion cooling switch, comprising a switch body and a condenser. The switch body includes a sealed shell, electronic elements arranged in the shell and a control panel arranged on the outer surface of the shell. The shell is provided with a gas outlet and a condensate reflux inlet in the upper part thereof. The air inlet of the condenser is connected with the gas outlet, and the liquid outlet of the condenser is connected with the condensate reflux inlet. The shell is internally provided with phase change insulating coolant, and the electronic elements are located below the liquid level of the insulating coolant. According to the easy-to-maintain liquid immersion cooling switch provided by the invention, by immersing the electronic elements inside the switch in the insulating liquid, the switch can be quickly cooled to meet the need of large-capacity and high-speed data processing, and the maintenance of the internal components ofthe switch can be facilitated.

Description

technical field [0001] The invention relates to the field of switches, in particular to a liquid immersion cooling switch which is easy to maintain. Background technique [0002] At present, with the rapid development of computer technology and the promotion of cloud computing and big data applications, the data center has ushered in a new construction climax. In the case of massive increase in information exchange, the capacity of switches is also growing rapidly. Currently, high-speed The heat dissipation of data switches has also encountered a bottleneck. Traditional air-cooled switches are increasingly difficult to meet the needs of large-capacity and high-speed data processing, mainly because the air-cooled heat dissipation capacity is difficult to meet the increase in power. In order to improve the heat dissipation capacity of the switch, those skilled in the art have proposed the idea of ​​setting a built-in heat dissipation structure in the switch, but setting a buil...

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Problems solved by technology

[0002] At present, with the rapid development of computer technology and the promotion of cloud computing and big data applications, the data center has ushered in a new construction climax. In the case of massive increase in information exchange, the capacity of switches is also growing rapidly. Currently, high-speed The heat dissipation of data switches has also encountered a bottleneck. Traditional air-cooled switches are increasingly difficult to meet the needs of large-capacity and high-speed data processing, mainly because the air-cooled heat dissipation capacity is difficult to meet its power growth.

In order to improve the heat dissipation capacity of the switch, those skilled in the art have proposed the idea of ​​setting a built-in heat dissipation structure in the switch, but setting a built-in heat dissipation structure in the switch will occupy a large amount of internal space of the switch, and it is not convenient for the maintenance of the internal components of the switch maintain

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