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Pressing sheet repairing device for semiconductor laser and working method and application thereof
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A working method and laser technology, applied in the field of LD packaging, can solve the problems of complex production and manufacture of tablet repairers, cumbersome tablet repair methods, and inability to ensure a uniform tablet speed, and achieve low production costs, manpower saving, and labor reduction. Effect
Inactive Publication Date: 2018-12-11
Shandong Huaguang Optoelectronics Co. Ltd.
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Abstract
Description
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Application Information
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Problems solved by technology
However, this tablet repair method is too cumbersome, and the push device is connected by a cylinder, which cannot guarantee the uniform speed of the tablet, which may cause damage to the tablet during the repair process.
Moreover, the manufacturing of the used tablet repairer is too complicated, and the processing cost is too high, which is not conducive to mass production.
Method used
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Embodiment 1
[0042] A compressed tablet repair device for a semiconductor laser, comprising:
[0043] Base 9: used to install the front pressure plate 1 and the rear pressure plate 2;
[0044] Front platen 1: fixed on the base 9;
[0045] Rear platen 2: movably arranged on the base 9 and opposite to the front platen 1; the front platen 1 and the rear platen 2 are connected by a slide bar 5;
[0046] Driving part: used to drive the rear platen 2 to move axially.
Embodiment 2
[0048]As described in Embodiment 1, a semiconductor laser tablet repairing device is different in that the driving part includes a base 10 fixed on the base 9, and guide sleeves are arranged at both ends of the base 10 in the axial direction. Ring 11 and card groove 12, a connecting column 7 is sleeved in the guide collar 11, one end of the connecting column 7 is connected with the rear pressure plate 2, and the other end of the connecting column 7 is connected to the The connection block 6 is connected, and the connection block 6 is rotated around the bolt 8; a rocker arm 4 is arranged at one end of the connection block 6; Size fits.
[0049] The sliding bar 5 is fixedly connected to the bottom of the front pressing plate 1 , and the rear pressing plate 2 is slidably sleeved on the sliding bar 5 .
[0050] The rear pressure plate 2 is fixedly connected to the connecting column 7 through a bolt column 13 .
[0051] According to the concentric principle of the slide bar, the ...
Embodiment 3
[0054] The working method of repairing device as described in embodiment 1-2, comprises:
[0055] Shorten the distance between the front platen 1 and the rear platen 2: drive the connecting column 7 by pressing down on the rocker arm 4, and slide the rear platen 2 along the slide bar 5 towards the front platen 1;
[0056] Increase the distance between the front platen 1 and the rear platen 2: the connecting column 7 is driven by lifting the rocker arm 4, and the rear platen 2 moves away from the front platen 1 along the slide bar 5.
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Abstract
The invention discloses a pressing sheet repairing device for a semiconductorlaser. The pressing sheet repairing device is characterized by comprising a base, a front pressing plate, a rear pressingplate and a driving part. The base is used for installing the front pressing plate and the rear pressing plate, the front pressing plate is fixed to the base, the rear pressing plate is movably arranged on the base and arranged opposite to the front pressing plate, the front pressing plate and the rear pressing plate are connected through a sliding rod, and the driving part is used for driving therear pressing plate to move in the axial direction. The pressing sheet repairing device for the semiconductorlaser optimizes the overall design of the repairing device, and the front pressing plateand the rear pressing plate are arranged oppositely and coaxially through the sliding rod, so that the front pressing plate and the rear pressing plate can efficiently perform shaping and repairing onpressing sheets of the semiconductorlaser.
Description
technical field [0001] The invention relates to a chip repairing device for a semiconductor laser, a working method and an application thereof, and belongs to the technical field of LD packaging. Background technique [0002] After decades of development, semiconductor lasers are widely used in medical equipment, material processing and other fields. In recent years, their competitiveness in the market has gradually increased. After decades of development, semiconductor lasers are becoming more and more well-known to the society. The appearance and volume of semiconductor lasers are small, and the weight is relatively light in the same field. Various advantages determine that they are widely used in many fields such as industry, military, medical treatment, and education. The technical production field of semiconductor lasers has gradually become the focus of the market and the focus of research in various countries. [0003] In recent years, semiconductor laser technology ...
Claims
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Application Information
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