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A high weatherability method for adhering an upper electrode and a lower electrode of a touch screen

A touch screen, weather-resistant technology, applied in conductive adhesives, adhesives, electrical digital data processing, etc., can solve the problems of touch screen appearance defects, conductive failure, separation, etc., to avoid deformation, avoid defects, and avoid bad appearance.

Active Publication Date: 2018-12-11
东莞市显触光电科技有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Therefore, the appearance of the touch screen produced by this method has flaws
[0006] On the other hand, in the prior art, carbon tapes, 3M conductive tapes or other conductive tapes are used to connect the upper electrode and the lower electrode, and the viscosity of the glue drops significantly at a low temperature below -10°C. Under the influence of colloid and electrode separation, conduction failure

Method used

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Embodiment Construction

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional rela...

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Abstract

A high weatherability method for adhering an upper electrode and a lower electrode of a touch screen includes such steps as pressing a bonded position of a flexible circuit board and a low electrode with anisotropic hot-melt conductive adhesive to make the flexible circuit board and the lower electrode electrically connected, arranging a double-sided adhesive on an upper electrode covered with anITO film on the Film in a matched manner, and maintaining a silver colloidal hole on the double-sided adhesive, wherein the silver colloidal hole corresponds to the silver colloidal point of the upperelectrode; hollowing out the silver glue dot in the insulating ink of the lower electrode to expose the conductive electrode; aligning the upper electrode and the lower electrode so that the silver paste passes through the silver paste hole; baking an upper electrode and a lower electrode which are matched in position at 60 to 80 DEG C for 15 to 25 minutes. The high weatherability method providedby the invention is used for bonding the upper electrode and the lower electrode of the touch screen, thereby avoiding deformation of the upper electrode due to the high temperature of the bonding, and further avoiding the defect of poor appearance.

Description

technical field [0001] The invention relates to a touch screen production technology, in particular to a high weather resistance bonding method for an upper electrode and a lower electrode of a touch screen. Background technique [0002] Touch screens have been widely used in mobile phones, tablet computers and other electronic display devices. Currently, capacitive touch screens widely used in the market can realize advanced and complex functions of multi-touch, so that they can be widely used in application fields. Because electronic devices have very high requirements on touch sensitivity and appearance. [0003] At present, the upper electrode and the lower electrode of the touch screen are laminated with the flexible circuit board on both sides. The two sides of the flexible circuit board are coated with anisotropic hot-melt conductive adhesive, one side of the flexible circuit board is pressed with the film (upper electrode), and the other side is pressed with the g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041G06F3/044C09J201/00C09J9/02
CPCC08K2003/0806C09J9/02C09J201/00G06F3/0412G06F3/044G06F2203/04103C08K3/08
Inventor 王刚
Owner 东莞市显触光电科技有限公司
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