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Heat sink

A radiator and heat sink technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. Novel design, not easy to fall off, saving man-hours

Pending Publication Date: 2018-12-18
THERMAL GROUP TECH HUIZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing radiator is assembled, connectors are often arranged to fix the radiator and the computer motherboard, and the positions of the screws on the radiator and the positions of the studs on the computer motherboard are prone to be inconsistent, resulting in inconvenient installation and the problem that the radiator is easy to fall off. Affect the heat dissipation effect of the radiator

Method used

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Examples

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Effect test

Embodiment 1

[0031] figure 1 is the whole of the radiator in this embodiment 1 Figure 1 , a radiator, comprising some heat sinks 5, fans 6 and some connecting mechanisms, each heat sink 5 is distributed radially in a circle, the fan 6 is arranged at the center of the heat sink 5, and each connection mechanism is evenly arranged on each heat sink 5 on.

[0032] figure 2 , 3 They are the exploded view and structural schematic diagram of the connection mechanism in the radiator respectively, wherein the connection mechanism includes screw 1, spring 2, screw through hole 3 and snap ring 4; screw 1 is penetrated in screw through hole 3, and spring 2 is sleeved On the screw 1, and the spring 2 is located between the screw through hole 3 and the nut 11 of the screw 1; the snap ring 4 is snapped on the screw 1, and the snap ring 4 abuts on the screw through hole 3 and is opposite to the spring 2 the other side of the

[0033] Figure 4 It is an enlarged view of the screws and springs in th...

Embodiment 2

[0040] Different from Example 1, as Figure 7 , each cooling fin 5 is radially distributed horizontally and vertically. The radiator provided by this embodiment is easy to install and use, and has a fast cooling effect, and is suitable for large-scale application of electronic devices and equipment.

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Abstract

The invention discloses a heat sink, comprising a plurality of heat sink fins, a fan and a plurality of connecting mechanisms, wherein, each heat sink fins is radially distributed, the fan is arrangedat the center of the heat sink fins, and each connecting mechanism is uniformly arranged on each heat sink fins at intervals; The connecting mechanism comprises a screw, a spring, a screw through hole and a clasp ring; The screw is pierced in the screw through hole, the spring is sleeved on the screw, and the spring is positioned between the screw through hole and the nut of the screw; The snap ring is snapped on the screw, and the snap ring abuts on the other side of the screw through hole opposite to the spring. The radiator of the invention is convenient to install and use, has fast heat dissipation effect, and is suitable for large-scale application of electronic devices and equipment.

Description

technical field [0001] The present invention relates to the technical field of radiators, and more specifically, to a radiator. Background technique [0002] At present, in the field of electronic and electrical technology, with the continuous increase of the conversion capacity of the power circuit, the power consumption increases accordingly, and various electronic components also generate huge heat, which brings about heat dissipation problems, and the radiator . The heat sink generally adopts to directly install heat-dissipating aluminum profiles on chips such as the CPU, and then cooperate with a heat-dissipating fan to dissipate heat. When the existing radiator is assembled, connectors are often arranged to fix the radiator and the computer motherboard, and the positions of the screws on the radiator and the positions of the studs on the computer motherboard are prone to be inconsistent, resulting in inconvenient installation and the problem that the radiator is easy ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20409
Inventor 谭弘平姜文新邓中应
Owner THERMAL GROUP TECH HUIZHOU
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