CPU radiator

Abstract

The invention relates to the field of CPU radiator, in particular to a CPU radiator, comprising a heat conducting mechanism, a fixing mechanism, a lighting mechanism, an air cooling mechanism, a mounting mechanism and a silicon coating mechanism. After the motor is connected to the power supply; the cold air is blown to the radiating ring from the ventilation port of the inverted eight-shaped structure on the side, As that fan blade is a radiate ring for air cool, Realize the heat dissipation of CPU, the silicon gel is coated on the inside of several silicon storage boxes during overhaul, rotating the rotary table to realize that the scraper uniformly coats the silica gel on the bottom of the heat dissipation ring, as that heat dissipate ring is conducive to heat dissipation, the inside ofthe bottom shell is fixedly connected with a rotating shaft with an inverted T-shaped structure. The rotating shaft is electrically connected with the conductive pillar, and the conductive pillar isconnected with a power supply to realize the lighting of the lamp bulb between the rotating shaft and the side wall of the fixed sleeve, so that the dust on the surface of the fan blade can be fully and clearly seen and the dust can be completely cleaned, which is conducive to heat dissipation, and the lamp bulb installed on the side wall of the fixed sleeve can reduce the resistance to the rotation of the fan blade.

Description

technical field [0001] The invention relates to the field of CPU radiators, in particular to a CPU radiator. Background technique [0002] The CPU heat sink is that the CPU will generate a lot of heat when it is working. If the heat is not dissipated in time, it will cause a crash in light cases, or burn the CPU in severe cases. The CPU heat sink is used to dissipate heat for the CPU. The radiator plays a decisive role in the stable operation of the CPU. It is very important to choose a good radiator when assembling the computer. [0003] However, the heat dissipation of traditional CPU heat sinks is only through fan air cooling. Silicone is applied to the CPU during maintenance. The heat conduction sheet can only dissipate heat through air cooling. The dust cleaning of the fan of the fan is carried out through the external power supply lighting inspection and maintenance. It does not have a lighting power supply to assist in the cleaning of the fan blades. The dust on the ...

AI Technical Summary

Problems solved by technology

[0003] However, the heat dissipation of traditional CPU heat sinks is only through fan air cooling. Silicone is applied to the CPU during maintenance. The heat conduction sheet can only dissipate heat through air cooling. The dust cleaning of the fan of the fan is carried out through the external power supply lighting inspection and maintenance. It does not have a lighting power supply to illuminate the fan blades to assist the dust removal.

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