Component having a reflector and method for producing components
A technology of reflectors and devices, which is applied in semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., can solve the problems of chip device efficiency reduction, light loss, and uneven color radiation, and achieve uniform color distribution , good cooling effect
Active Publication Date: 2018-12-21
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0002] Chip Scale Packages (CSPs) generally suffer from problems in terms of efficiency and color non-uniformity with respect to emission angle
It often occurs in such chip arrangements that the light is emitted in the opposite direction, which often leads to light losses and thus to a reduction in the efficiency of the chip arrangement
Method used
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Embodiment Construction
[0033] exist figure 1 The device 100 is shown. The device 100 has a semiconductor chip 1, a reflector 2, and a package 3. Reflector 2 frames are disposed around the semiconductor chip 1. In the lateral direction, the semiconductor chip 1 is surrounded by a reflector 2. In a top view, the package 3 completely covers the semiconductor chip 1. The reflector 2 is also covered by the package 3.
[0034] The device 100 has a front side 101 and a rear side 102 that facing the front side 101. When the device 100 is run, the semiconductor chip 1 is configured to generate electromagnetic radiation. The front side 101 of the device 100 is in particular as a radiation exit side of the device 100. In particular, device 100 can be constructed in a surface mounted. That is to say, the device 100 can be electrically contacted in particular via its rear side 102.
[0035] according to figure 1 The rear side 102 of the device 100 includes the rear side of the reflector 2 and the rear side 12 of the...
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Abstract
The invention relates to a component (100) having a semiconductor chip (1), a casing (3) and a reflector (2), wherein the semiconductor chip (1) has a front side (11), a rear side (12) facing away from the front side (11) and lateral surfaces (10), wherein the semiconductor chip (1) can be electrically contacted at least partially via the rear side (12) thereof, the reflector (2) completely surrounds the semiconductor chip (1) in lateral directions, and said reflector has a first sub-region (21) and a second sub-region (22) directly adjacent to the first sub-region (21), wherein the first sub-region (21) is spatially at a distance from the semiconductor chip (1) and the second sub-region (22) is directly adjacent to the semiconductor chip (1), and the casing (3) completely covers the frontside (11) of the semiconductor chip (1) and at least partially covers the lateral surfaces (10) of the semiconductor chip (1), such that the casing (3) has a boundary surface (32) facing the semiconductor chip (1) that reproduces a contour of the semiconductor chip (1) in sections. The invention also relates to a method for producing a plurality of components of this type.
Description
Technical field [0001] A device with a reflector is proposed. Further, a method for manufacturing a plurality of such devices is proposed. Background technique [0002] Chip-level package (CSP) is usually affected in efficiency and in terms of color unevenness of radiosity. In such a chip device: light is radiated in the reverse direction, which often causes light loss and thus results in a decrease in the efficiency of the chip device. Due to the low efficiency in the reverse direction, it is particularly remarkable in volume emitter. Here, color unevenness is typically attributed to different optical path lengths of the chip device in different directions in different directions in different directions in different directions. Inventive content [0003] It is an object of the present invention to provide a device having a color uniform with an improved efficiency and an improvement of the radiation angle. Another object is to propose a method for making a cost-effective and si...
Claims
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IPC IPC(8): H01L33/52H01L33/60
CPCH01L33/52H01L2224/16245H01L2224/48091H01L2224/73265H01L2224/8592H01L33/60H01L2924/00014H01L23/04H01L23/06H01L27/156H01L33/505H01L33/507H01L33/62H01L2933/005H01L2933/0058
Inventor 米夏埃尔·屈内尔特亚历山大·林科夫
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG