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Target material processing method

A processing method and target technology, used in metal processing equipment, metal processing machinery parts, manufacturing tools, etc., can solve the problems of unqualified products, damage to the surface of the target, damage to the tool, etc., and achieve the effect of easy fracture

Inactive Publication Date: 2019-01-01
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the process of cutting the target, chips will be generated on the surface of the target, and the chips are not easy to fall off the surface of the target. When more chips accumulate on the surface of the target, on the one hand, it will damage the surface of the target. surface, resulting in unqualified products; on the other hand, the chips will also wrap around the tool used for cutting, which may damage the tool

Method used

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  • Target material processing method

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Embodiment Construction

[0019] The inventors have found through research that: when the target is cut, chips will be generated on the surface of the target, and the chips accumulated on the surface of the target will easily damage the target and damage the tool. In the prior art, in order to solve the above problems, tools such as pliers or iron hooks are usually used. When chips are generated on the surface of the target, the pliers or iron hooks are used to clean them to prevent the chips from accumulating on the surface of the target. However, using this method to clean chips, pliers or iron hooks are easy to contact the surface of the target and damage the target; moreover, this cleaning method usually requires manual operation of pliers or iron hooks, which increases labor costs; once the chips are thrown to the human body due to breakage , It is easy to cause harm to the human body, and there is a potential safety hazard. Therefore, there is an urgent need to provide a new target processing met...

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Abstract

Disclosed is a target material processing method. The method includes the following steps: providing a target material and a cutter, wherein the cutter is used for cutting the target material; and providing a coolant, and spraying the coolant to a cut part of the target material when the cutter cuts the target material, wherein the spraying pressure of the coolant is controlled between 100 kg / cm<2> and 150 kg / cm<2>. Therefore, during the cutting of the target material, when chips are generated on the surface of the target material, the coolant with high spraying pressure can break the chips, and so the chips cannot accumulate on the surface of the target material, thereby avoiding damage to the surface of the target material or the cutter. Meanwhile, the coolant with high spraying pressurecan quickly cool the chips so as to harden the chips due to the reduction of temperature, thereby making the breaking of the chips easier.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for processing a target. Background technique [0002] In the semiconductor sputtering process, the target as a sputtering source (the target material bombarded by high-speed energetic particles) needs to have a specific shape so that it can be fixed to the sputtering equipment to meet the requirements of sputtering. In addition, the target material used for sputtering is also required to have a small surface roughness to meet the specified accuracy requirements. Therefore, before the target is processed into a final product, it is usually necessary to cut the target so that the target has a specific shape and high precision to meet the requirements of sputtering. [0003] However, in the process of cutting the target, chips will be generated on the surface of the target, and the chips are not easy to fall off the surface of the target. When more chips accumulate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23Q11/00B23Q11/10
CPCB23Q11/0075B23Q11/10
Inventor 姚力军潘杰相原俊夫王学泽鲍伟江
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD