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A kind of heat-conducting silicone grease for computer CPU and preparation method thereof

A heat-conducting silicone grease and computer technology, which is applied in the field of heat-conducting silicone grease, can solve the problems that the solid content of the heat-conducting silicone grease composition cannot increase the thermal conductivity, and the thermal conductivity of the heat-conducting silicone grease composition has not been improved, so as to improve the thermal conductivity , the effect of simple steps

Active Publication Date: 2021-09-10
江门市硅成新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the thermal conductivity of the thermally conductive silicone grease composition, it is usually used to increase the solid content of the thermally conductive silicone grease composition, but the solid content of the existing thermally conductive silicone grease composition has reached 90%. The thermal conductivity of the grease composition has no room for improvement
Tsinghua University Chen Kexin et al. (CN 101294067 B) adopt silane coupling agent to coat the surface of thermally conductive powder to prepare thermally conductive silicone grease composition. The defect of improving thermal conductivity, but the highest thermal conductivity of the thermally conductive silicone grease composition prepared by this method is only 6.9W / (m·K)

Method used

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  • A kind of heat-conducting silicone grease for computer CPU and preparation method thereof
  • A kind of heat-conducting silicone grease for computer CPU and preparation method thereof
  • A kind of heat-conducting silicone grease for computer CPU and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Preparation of thermally conductive filler coated with acrylic-cage polysilsesquioxane:

[0024] Disperse 10.0g of thermally conductive filler (average particle size of 20μm) and 5.0g of acrylic-cage polysilsesquioxane in 50ml of acetonitrile solution for 10-15min, then add 0.3g of ferrous sulfate and 0.6g of potassium persulfate React at 70-80°C for 16-18h, then cool down to room temperature, filter, wash with ethanol, and then dry under reduced pressure at 90°C to constant weight to obtain acrylic-cage polysilsesquioxane-coated thermally conductive filler.

[0025] 2. Preparation of thermal conductive silicone grease

Embodiment 2

[0031] The present invention selects aluminum nitride coated with acrylic-cage polysilsesquioxane as a thermally conductive filler, and further screens the type of base material. The steps are as follows:

[0032] Take 10.0g of acrylic-cage polysilsesquioxane-coated aluminum nitride (average particle size crushed to 20 μm) and 10.0g of different types of base materials and place them in a homogenizer at a speed of 6000-8000rpm, 20 Homogenize at -30°C for 30-60min, then reduce the speed to 3000-4000rpm, add 0.04g 1-allyl-3-methylimidazole chloride, homogenize for 10-20min, and finally place in an ultrasonic reactor at 20-30°C Ultrasonic 13h obtains the heat-conducting silicone grease for computer CPU of the present invention, and the heat-conducting silicone grease prepared by different base materials is tested for thermal conductivity, and the results are shown in Table 2:

[0033] Table 2 Effect of base material on thermal conductivity of thermal grease

[0034]

[0035] ...

Embodiment 3

[0037] After selecting aluminum nitride coated with acrylic-cage polysilsesquioxane as the thermally conductive filler and benzyl silicone oil as the base material, the present invention optimizes the ratio of the components in order to improve the thermal conductivity of silicon The thermal conductivity of the grease, the method is as follows:

[0038] Acrylic-cage polysilsesquioxane-coated aluminum nitride (average particle size crushed to 20 μm) and benzyl silicone oil were placed in a homogenizer and homogenized at a speed of 6000-8000 rpm for 30-60 minutes. Then reduce the rotating speed to 3000-4000rpm, add 1-allyl-3-methylimidazole chloride and homogenize for 10-20min, and finally place it in an ultrasonic reactor for 16h to obtain the heat-conducting silicone grease for computer CPU according to the present invention. The thermal conductivity silicone grease prepared by proportioning raw materials was tested for thermal conductivity, and the results are shown in Table ...

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Abstract

The invention belongs to the technical field of heat-conducting silicone grease, and in particular relates to a heat-conducting silicone grease for a computer CPU and a preparation method thereof. The present invention uses acrylic-cage polysilsesquioxane for the first time to coat the thermally conductive filler, and forms a high-thermal-conductivity thermal-conductive filler with organic silicone oil base material and 1-allyl-3-methyl imidazole chloride Silicone grease composition: The heat-conducting silicone grease of the present invention has simple ingredients and a preparation method, and has high thermal conductivity, which can meet the thermal conductivity requirements of large-scale computer CPUs.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting silicone grease, and in particular relates to a heat-conducting silicone grease for a computer CPU and a preparation method thereof. Background technique [0002] In recent years, with the development of science and technology, the densification and miniaturization of integrated circuits has become higher and higher, electronic components have become smaller and run at faster speeds, and the power density has continued to increase. More heat will be generated inside. According to statistics, CPU failures caused by overheating account for 55% of the total number of CPU failures, and every 10% increase in operating temperature reduces reliability by 50%. [0003] As a result, many heat dissipation technologies and heat dissipation materials have been developed. Among them, thermal interface materials are widely used because they can effectively reduce the interface thermal resistance betwee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08L83/06C08L83/07C08K9/10C08K3/28C08K3/22C08K3/34C08K5/3445
CPCC08K3/22C08K3/28C08K3/34C08K5/3445C08K9/10C08K2003/2227C08K2003/282C08K2201/003C08L83/04C08L83/06
Inventor 孙蓓蓓
Owner 江门市硅成新材料有限公司
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