Integrated circuit board excessive glue cleaning equipment

Abstract

The invention discloses integrated circuit board excessive glue cleaning equipment. The integrated circuit board excessive glue cleaning equipment comprises a bottom plate; a first bearing is clampedon the upper surface of the bottom plate; a first rotating shaft is sleeved in the first bearing; a driven gear sleeves the surface of the first rotating shaft; the driven gear is engaged with a driving gear; and the lower surface of the driving gear is fixedly connected with an output shaft of a motor. According to the integrated circuit board excessive glue cleaning equipment, by arranging the motor, the output shaft of the motor rotates to drive the driving gear to rotate, and the first rotating shaft drives a first extruding plate to rotate, the first extruding plate can directly drive anintegrated circuit board to rotate after a second extruding plate can fix the integrated circuit board; and therefore, the position of the integrated circuit board can be directly adjusted to be convenient for people to clean glues remaining in different positions of the surface of the integrated circuit board without people to manually adjust the position of the integrated circuit board; and convenience is provided for people during machining the integrated circuit board.

Description

technical field [0001] The invention relates to the technical field of integrated circuit boards, in particular to an integrated circuit board overflow glue cleaning device. Background technique [0002] An integrated circuit is a microelectronic device or component that uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together to form a small or several small semiconductor chips or chips. Dielectric substrate, and then packaged in a package to become a microstructure with the required circuit function. [0003] In the process of encapsulating integrated circuit boards, encapsulation glue is needed for encapsulation. However, in general colloidal encapsulation, overflowing glue is prone to occur, resulting in excess glue remaining on the circuit board, which needs to be cleaned up in time, while traditional overflowing The glue treatment method is to manually clean up th...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit board glue overflow cleaning device, which solves the problem that the traditional glue overflow treatment method is to manually clean up the residual glue, and when people are cleaning the overflow of the integrated circuit board package When gluing, it is also necessary for people to manually change the position of the integrated circuit board, so as to clean up the residual colloid on the surface of the integrated circuit board in turn. However, due to the small size of the integrated circuit board, it is not convenient to change its position, thereby increasing the work intensity of the workers.

Images