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Liquid immersion-cooled electronic device

一种电子设备、冷却液的技术，应用在电气设备构造零部件、冷却/通风/加热改造、电气元件等方向，能够解决浪费冷却、削减耗电需求、变大等问题

Inactive Publication Date: 2019-01-04
EXASCALER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the data center, about 45% of the power consumption of the entire data center is wasted for cooling, and the demand for reducing power consumption by increasing the cooling efficiency is increasing.

Method used

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  • Liquid immersion-cooled electronic device
  • Liquid immersion-cooled electronic device
  • Liquid immersion-cooled electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0157] Hereinafter, preferred embodiments of the electronic device of the present invention will be described in detail based on the drawings.

[0158] First, refer to Figure 1 ~ Figure 4 , the electronic device 100 according to one embodiment of the present invention will be described. figure 1 is a front view of an electronic device 100 according to an embodiment of the present invention, image 3 is the side view, Figure 4 is a top view. The electronic device 100 is directly cooled by immersing in a cooling liquid in a cooling device described later, and is configured so that it can be respectively stored in a plurality of storage parts of the cooling device. The electronic device 100 includes: a base plate 110 provided in a later-described accommodating portion and held by a pair of later-described board holders; A substrate set 120 .

[0159] In the illustrated example, each substrate group 120 is four first circuit substrates 121, such as figure 2 As shown, the ...

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PUM

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Abstract

Provided is an electronic device that is directly cooled by immersion in a cooling liquid within a cooling device. This electronic device is configured to enable housing in a housing unit of the cooling device, and includes a baseboard, a plurality of storage substrates disposed on at least one surface of the baseboard, a backplane attached perpendicularly to the one surface of the baseboard, anda plurality of flash storage devices mounted to each of the plurality of storage substrates. The backplane comprises a combination of a plurality of backplane sections, and each of the plurality of backplane sections is provided with a signal connector and a power source connector. In addition, the signal connector and the power source connector are provided independently for each backplane section. The plurality of flash storage devices are disposed so as to be mutually adjacent, in a plane parallel to at least one surface of the storage substrates, in either the width direction or the lengthdirection of the flash storage devices.

Description

technical field [0001] The invention relates to electronic equipment, in particular to electronic equipment immersed in cooling liquid in a cooling device and directly cooled. In this specification, an electronic device generally refers to, but is not limited to, an electronic device that requires ultra-high performance and stable operation and generates a large amount of heat itself, such as a supercomputer and a data center. Background technique [0002] In recent years, one of the biggest issues determining the limit of the performance of supercomputers is power consumption, and the importance of research on energy saving properties of supercomputers has been widely recognized. That is, the speed performance per unit power consumption (Flops / W) becomes an index for evaluating a supercomputer. In addition, in a data center, about 45% of the power consumption of the entire data center is wasted for cooling, and there is an increasing need to reduce power consumption by inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20H05K7/02H05K7/20
CPCG06F1/18G06F2200/201H05K7/20772G06F1/20H05K7/20236G06F1/182G06F1/183
Inventor 齐藤元章
Owner EXASCALER