OLED display substrate, display device and manufacturing method thereof
A technology for displaying substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as the possibility of receiving light from adjacent pixels, difficulties in cathode patterning, and optical detection interference
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Embodiment 1
[0081] Such as figure 2 As shown, in this embodiment, the bottom-emitting OLED display substrate includes a driving circuit layer on the second base substrate 7 and a plurality of light-emitting units, and the light-emitting units include a light-transmitting anode, a cathode 4, and an anode and a cathode. The organic light-emitting layer 5 between 4, wherein, 6 shown in the figure includes a driving circuit layer and an anode. When forming the cathode 4 , a low-temperature process can be used to deposit a layer of transparent conductive material with a high thickness as the cathode, such as ITO and IZO. The high thickness can ensure the resistance performance of the cathode 4 .
[0082] After the cathode 4 is formed, a thin film encapsulation layer 8 is formed on the cathode 4 , the thin film encapsulation layer 8 can prevent subsequent processes from affecting the cathode 4 and the organic light-emitting layer 5 .
[0083] Afterwards, a reflective layer 9 is fabricated on ...
Embodiment 2
[0086] Such as image 3 As shown, in this embodiment, the bottom-emitting OLED display substrate includes a driving circuit layer on the second base substrate 7 and a plurality of light-emitting units, and the light-emitting units include a light-transmitting anode, a cathode 4, and an anode and a cathode. The organic light-emitting layer 5 between 4, wherein, 6 shown in the figure includes a driving circuit layer and an anode. When forming the cathode 4 , a low-temperature process can be used to deposit a layer of transparent conductive material with a high thickness as the cathode, such as ITO and IZO. The high thickness can ensure the resistance performance of the cathode 4 .
[0087] After the cathode 4 is formed, a thin film encapsulation layer 8 is formed on the cathode 4 , the thin film encapsulation layer 8 can prevent subsequent processes from affecting the cathode 4 and the organic light-emitting layer 5 .
[0088] Afterwards, a reflective layer 9 is fabricated on t...
Embodiment 3
[0092] Such as Figure 4 As shown, in this embodiment, the bottom-emitting OLED display substrate includes a driving circuit layer on the second base substrate 7 and a plurality of light-emitting units, and the light-emitting units include a light-transmitting anode, a cathode 4, and an anode and a cathode. The organic light-emitting layer 5 between 4, wherein, 6 shown in the figure includes a driving circuit layer and an anode. When forming the cathode 4 , a low-temperature process can be used to deposit a layer of transparent conductive material with a high thickness as the cathode, such as ITO and IZO. The high thickness can ensure the resistance performance of the cathode 4 .
[0093] After the cathode 4 is formed, a reflective layer 9 is formed on the cathode 4. Specifically, a layer of reflective metal material can be formed on the cathode 4, and then the reflective metal material is etched (including wet etching and dry etching) to form a light-transmitting hole. The l...
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