A flexible plate and an assembly system thereof meeting the industry standard

Abstract

The invention relates to a flexible plate and an assembling system thereof meeting the industry standard. The flexible plate comprises a flexible plate body, a main via region, a standard pad region and a pair of positioning holes, wherein the main via region and the standard pad region are respectively arranged at two ends of the flexible plate body, a pair of positioning holes are close to the standard pad region, and the pair of positioning holes are symmetrical along the vertical centerline of the flexible plate body; a main via hole correspond to that electrical network of the pins of thephotoelectric device or module to be fabricated or tested is arranged in the main via hole area. In the standard pad area there is a set of standard pads that correspond to the electrical network ofthe main vias and conform to industry standards. The invention has the advantages of effectively avoiding the abnormality caused by the complete symmetry of the external dimension and the deflection of the pins to one side of the component soldering and assembling, and avoiding the poor butt joint or even misalignment of the pads of the flexible board and the test circuit board although the pads are dense.

Description

technical field [0001] The invention relates to the technical field of photoelectric communication equipment, in particular to a flexible board meeting industry standards and an assembly system thereof. Background technique [0002] In electronic equipment, a flexible soft board called a flexible printed wiring board (Flexible Printed Circuit, FPC) is widely used in order to configure its circuit. A flexible board is a flexible sheet made of polyimide film or the like. A structure in which wiring is formed on a conductive layer such as copper foil on a base material. The flexible soft board has a thin thickness and can be bent, flexed and other deformations. Therefore, according to the flexible flexible board, it is possible to arrange the wiring in the gap in the electronic device, or arrange the wiring in the movable part, or arrange the wiring three-dimensionally. [0003] In the case where the flexible board is composed of two or more layers, in order to electrically c...

AI Technical Summary

Problems solved by technology

[0004] Since the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible boards, which not only affects appearance, but also affects performance, leading to the use of flexible boards. The product must be replaced with a new flexible board at high temperature before it is sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Images