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A combined integrated circuit board with good heat dissipation performance

An integrated circuit board, heat dissipation technology, applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc. Increases heat dissipation and facilitates cleaning

Inactive Publication Date: 2019-01-11
傅朝霞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a combined integrated circuit board with good heat dissipation performance, which solves the problem that the existing integrated structure is single, not flexible enough to be used in various situations, and has poor heat dissipation performance and often needs to be replaced. question

Method used

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  • A combined integrated circuit board with good heat dissipation performance
  • A combined integrated circuit board with good heat dissipation performance
  • A combined integrated circuit board with good heat dissipation performance

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-3 , a combined integrated circuit board with good heat dissipation performance, including a base plate A01 and a left integrated circuit board A08, the inside of the base plate A01 is provided with a fan frame A02, and the upper end surface of the base plate A01 is hollowed out, so that the left integrated circuit board A08 and the left integrated circuit board A08 The right integrated circuit board A16 will not overheat duri...

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Abstract

The invention discloses a combined integrated circuit board with good heat dissipation performance, including a backplane and a left integrated circuit board, the inner part of the bottom plate is provided with a fan outer frame, a fan rotating shaft is installed below the motor, the left side of the top end of the bottom plate is provided with a left sliding groove, a first stop lever is mountedbelow the left integrated circuit board, the surface of the first limiting lever is provided with a spring, a left connecting rod is mounted on the right side of the left integrated circuit board, a rotating shaft is mounted on the right side of the left connecting rod, a right integrated circuit board is mounted on the right side of the right connecting rod, a fourth limiting rod is mounted on the right side of the third limiting rod, a right slider is arranged on the right end of the right integrated circuit board, and a fan air port is arranged on the bottom surface of the bottom plate. Theinvention protects the integrated circuit board and solves the problem of poor heat dissipation of the existing integrated circuit board through the hollowed-out design of the upper end face of the bottom board so that the left integrated circuit board and the right integrated circuit board do not overheat when working.

Description

technical field [0001] The invention relates to the field of integrated circuit boards, in particular to a combined integrated circuit board with good heat dissipation performance. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits, but it is often said that the integrated circuit board also carries the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology. Many components such as transistors, resistors and capacitors are fabricated on a smaller single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multilayer wiring or tunnel wiring. [0003] At present, the existing integrated circuit boards on the market have a single structure, are not flexible enough to be used in various situations, and have poor heat dissipation performan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/16H05K7/14H05K7/20
CPCH05K7/16H05K7/1402H05K7/20136
Inventor 傅朝霞
Owner 傅朝霞
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