Grinding device

Abstract

A grinding device is provided that easily discharges grinding water to the outside of the grinding wheel arranged in a ring shape. The grinding device (1) has a grinding water supply unit (30), and the grinding water supply unit has: a through passage (31), which runs through the main shaft (14) and the mounting seat (13); and the grinding water nozzle (32 ), which is arranged in the center of the mounting surface (13a) side of the mounting base, communicates with the through passage to release grinding water (GW), and the grinding water nozzle has: a cylinder (33), which hangs down from the mounting base; part (34), which is formed at the free end part (33a) of the cylinder; and a guide part (35), which guides the grinding water flowing down in the through passage, so that the grinding water flows along the inner wall of the cylinder (33b) flows, and the water discharge part has a chamfered part (34a) that makes the grinding water discharge in a flared shape, so the grinding water can be uniformly supplied to the front end part of the entire circumference of the grinding tool (12) arranged in a ring shape. , the grinding water is easily discharged from the slight gap between the surface to be ground of the wafer (W) and the grinding tool to the outside of the grinding tool.

Description

technical field [0001] The present invention relates to a grinding apparatus for grinding wafers. Background technique [0002] When the wafer is thinned by grinding, there is a problem that the rigidity of the wafer is lowered, and it is difficult to handle the wafer in the subsequent process. Therefore, for example, a grinding method has been proposed in which a diameter smaller than the diameter of the wafer is used. A grinding wheel in which a grinding wheel is arranged in a ring shape, a recess is formed in a region corresponding to a device region on which a plurality of devices are formed on the back surface of the wafer, and a ring shape is formed in a region corresponding to the outer peripheral remaining region on the outer peripheral side of the device region. (for example, refer to the following Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2013-165287 [0004] However, in the above-mentioned grinding method, the grinding wheel i...

AI Technical Summary

Problems solved by technology

Therefore, the grinding water stagnates on the inside of the grinding tool and cannot sufficiently cool the grinding tool, and there is also the problem of scratching the surface to be ground due to the grinding debris contained in the stagnant grinding water and the consumption of the grinding tool. speeding up the problem

In addition, when grinding with a worn-out grinder, the corners of the recesses formed on the wafer are rounded and cannot be at right angles, so there is a problem that the chip at the outermost peripheral portion of the wafer cannot be flattened.

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