Silicon wafer loading equipment and loading method thereof

A technology for loading equipment and silicon wafers, which is applied in the field of silicon wafers, can solve the problems of small application range and unstable adsorption of silicon wafers, and achieve the effects of firm adsorption, stable placement of silicon wafers, and enlarged adjustment range
CN109205288AActive Publication Date: 2019-01-15张家港市欧微自动化研发有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
张家港市欧微自动化研发有限公司
Publication Date
2019-01-15

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Abstract

The invention discloses silicon wafer loading equipment. The silicon wafer loading equipment comprises a suction disc and a silicon wafer table, wherein the suction disc is located in the y direction;and the silicon wafer table is located below the suction disc and matched with the suction disc. The silicon wafer table is provided with a base, two first block bodies, two second block bodies and two third block bodies and two loading assemblies. The two first block bodies are located above the base; the connection line of the two first block bodies is parallel with the x direction; and the twofirst block bodies are located in the x negative direction. The two second block bodies are located above the first block bodies correspondingly and are in the x negative direction. The two third block bodies are located above the two second block bodies correspondingly and are in the x negative direction. The two loading assemblies are located above the third block bodies correspondingly and aresymmetrical about the y direction. The equipment can move in all directions and is applicable to silicon wafer samples of various sizes and large in application scope; and the silicon wafer samples can be adsorbed firmly.
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Description

technical field

[0001] The invention relates to the field of silicon wafers, in particular to a silicon wafer loading device and a loading method thereof. Background technique

[0002] Chips are modern miniature "knowledge bases" with super-storage capabilities. The size, thickness, surface damage, and shape defects of the silicon wafer will have a huge impact on the performance of the silicon wafer, so it is necessary to perform fine measurement of the surface information of the silicon wafer. In the prior art, the optical measuring equipment used for measuring the surface information of silicon wafers loads silicon wafers through a silicon wafer buffer loading device during use.

[0003] For example, the patent document CN201210479223.1 is a silicon wafer buffer loading device, including a silicon wafer table and a suction cup, the suction cup is matched with the silicon wafer table, the silicon wafer table has a base, and it is characterized in that it also includes a bu...

Claims

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