An oscilloscope and image processing method thereof
A technology of image processing and oscilloscope, which is applied in the direction of instruments, measuring devices, measuring electrical variables, etc., can solve the problem that the temperature change curve of the target component cannot be reflected, and achieve the effect of troubleshooting circuit design problems
Active Publication Date: 2021-01-15
UNI TREND TECH (CHINA) CO LTD
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[0003] In view of the above problems, the object of the present invention is to provide an oscilloscope combined with a thermal imager and an image processing method thereof, in which algorithms such as infrared temperature compensation and correction are embedded in the traditional oscilloscope to analyze the infrared thermal radiation data received by the front-end thermal imager, It is used to solve the problem that thermal imagers and oscilloscopes in the prior art cannot reflect the temperature change curve of the target component in unit time, and the change curve of the target temperature and its electrical signal
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[0040] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0041] The embodiment of the present invention provides an oscilloscope, such as figure 1 As shown, the oscilloscope includes: a front-end data receiving system for collecting infrared radiation on the surface of the target under test, a back-end data processing system that communicates with the front-end data receiving system and performs data processing and display, and a power supply for supplying power to the system system.
[0042] The front-end data receiving system includes: a thermal imaging sensor module 101 for sensing the infrared thermal radiation on the surface of the object to be measured, and converting the infrared thermal radiation into the original data of the thermal image; a front-end processor 102, which is connected with the thermal imaging sensor module. The group 101 communicates to obtain the thermal image and the raw temperatu...
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The invention relates to an oscilloscope and an image processing method thereof. The oscilloscope comprises a data receiving unit used for receiving thermal image data; a parsing unit used for parsingthe received thermal image data to obtain a thermogram; a calculation unit for calculating temperature data of each pixel of the thermogram and performing algorithm compensation to make the temperature data more accurate; a positioning unit used for comparing the temperature of each pixel of the thermogram with a standard temperature reference value, and positioning abnormal temperature points; and a display unit used for displaying the thermogram and the abnormal temperature points. The oscilloscope can observe a change curve of the temperature of a target component within unit time, and canalso observe a change curve of the temperature of the target component and a voltage signal of the target component, so that an electronics engineer can be facilitated to analyze a change relationship of the performance of the component that is influenced by the temperature, thereby troubleshooting circuit design problems.
Description
technical field [0001] The invention belongs to the field of circuit detection, in particular to an oscilloscope and an image processing method thereof. Background technique [0002] At present, the traditional digital oscilloscope has the waveform analysis function for general circuit signals, but it is often difficult to locate and analyze when there is a short circuit in the circuit, the power of the components is too large, and the power utilization rate is too low. The traditional thermal imager can analyze the local temperature through the thermal image, and then analyze the temperature of the specific target, but it cannot analyze the specific circuit problem through the thermal image, nor can it observe the temperature change of the target component in unit time. curve, as well as the target temperature and its electrical signal change curve, so that electronic engineers cannot analyze the change curve of component performance affected by temperature, and they cannot...
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IPC IPC(8): G01R35/00
CPCG01R35/00
Inventor 胡明蔡伟明金占华陈闰
Owner UNI TREND TECH (CHINA) CO LTD