Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for repairing substrate defects

A defect repair and defect technology, used in grinding machine tools, metal processing equipment, manufacturing tools, etc., can solve the problems of more than a specified number of repairs and lower product qualification rates, so as to reduce labor costs, improve product qualification rates, and improve automation. degree of effect

Active Publication Date: 2021-04-06
HKC CORP LTD +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For defects that need to be repaired, the existing operation process is that the operator judges according to the screen and guides the repair equipment to grind and repair the defect. Once the operator makes a wrong judgment, it will cause the grinding device to repair a defect more than the specified number of times. As a result, the yield of products repaired by grinding is reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for repairing substrate defects
  • Method and system for repairing substrate defects
  • Method and system for repairing substrate defects

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.

[0038] It should also be understood that the terminology used ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a substrate defect repairing method and system, wherein the method includes: controlling the photographing device to photograph the surface of the substrate to be tested; obtaining defect information of the substrate according to the photographing result; Conditional defects are used as target defects; positioning the target defects; judging whether the target defects meet the second preset condition; if the target defect meets the second preset condition, controlling the grinding device to repair the target defect according to the positioning result. By identifying the target defect and locating it, it is judged whether the target defect meets the second preset condition. If so, the grinding device is controlled to grind it according to the positioning result, thereby improving the automation of the grinding device, reducing labor costs, and avoiding It eliminates the mistakes of human judgment and improves the qualified rate of products repaired by grinding.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a substrate defect repairing method and system. Background technique [0002] In the production of existing substrates, such as color filter (CF) substrate manufacturing process, there will inevitably be various defects. The existing solution classifies defects by taking pictures of the surface of the color filter substrate and then automatically or by human eyes. and judgment identification. For defects that need to be repaired, the existing operation process is that the operator judges according to the screen and guides the repair equipment to grind and repair the defect. Once the operator makes a wrong judgment, it will cause the grinding device to repair a defect more than the specified number of times. As a result, the qualified rate of products repaired by grinding is reduced. Contents of the invention [0003] The invention provides a substrate defect repairin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B37/34B24B49/12
CPCB24B37/042B24B37/34B24B49/12
Inventor 陈翔刘浩
Owner HKC CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com