A packaging module for loading an electronic component and a packaging box thereof
A technology for encapsulating modules and electronic components, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of offset of the electrical connection part 122, inconvenient welding, difficulties in automatic processing and production, etc., to avoid offset and improve convenience. sexual effect
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[0030] Refer to image 3 , 4 5. An embodiment of the packaging module of the present invention is used to load a number of electronic components 2, each electronic component 2 has a number of wire heads 21, and the packaging module contains a number of packaging boxes 3, and a connection can be cut The connecting material frame 4 of the packaging box 3, in this embodiment, the electronic components 2 are electrically connected and mounted on the respective packaging boxes 3, but at least two of the said electronic components can also be assembled in each packaging box 3. Electronic components 2. The packaging box 3 includes a box base 30 and a plurality of terminals 31 electrically connected to the corresponding electronic component 2 and assembled in the box base 30. In order to facilitate the distinction between the box base 30 and the terminal 31 of each package box 3, in the figure, a black dot is marked on the terminal 31 for distinction.
[0031] Refer to Figure 5 , 6 7. ...
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