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Sensing wafer structure of optical ruler read head

A technology for sensing wafers and optical rulers, applied in the direction of optical devices, measuring devices, instruments, etc., can solve problems affecting measurement results, light refraction or diffraction, and large volume of the optical reading head 7, and meet the requirements of miniaturization , the effect of volume reduction

Inactive Publication Date: 2019-01-22
台濠科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the above-mentioned known structure, the subscale 71 is a three-dimensional structure occupying a certain volume, and it is separated from the photosensitive module 72 by a space 74 and connected with a connecting piece 73, so that the entire optical pickup 7 occupies Large volume, it is difficult to meet the trend of equipment miniaturization in the precision industry
[0004] In addition, in the known structure, since the space 74 between the sub-scale 71 and the photosensitive module 72 contains air molecules, even dust, impurities and other suspended particles, it may cause refraction or diffraction when the light passes through. , thus affecting the measurement results

Method used

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  • Sensing wafer structure of optical ruler read head
  • Sensing wafer structure of optical ruler read head
  • Sensing wafer structure of optical ruler read head

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Embodiment Construction

[0019] see figure 1 , shows the sensing chip structure of the optical ruler reading head provided by the present invention, which includes a PCB substrate 1, on which at least one conductive pad 11 is arranged; in this embodiment, both sides of the substrate 1 A conductive pad 11 is respectively provided.

[0020] As above, a photosensitive chip 2 is arranged on the substrate 1 to sense light and convert it into a signal for back-end interpretation. The photosensitive chip 2 is provided with at least one pin 21. In this embodiment, a pin 21 is respectively provided on both sides of the photosensitive chip 2, and each pin 21 is extended to an extension portion 22 by redistribution process (RDL). Each extension portion 22 is connected to a conductive pad 11 by a wire 23 respectively. The photosensitive chip 2 is provided with a coding layer 3 that can interact with the scale of the optical ruler on the surface of the side opposite to the substrate 1, and it is only a pattern ...

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Abstract

The present invention discloses a sensing wafer structure of optical ruler read head, the structure comprises a substrate provided with at least one conductive pad. Wherein the substrate is provided with a photosensitive chip, which is provided with at least one pin, and each pin is respectively connected to a conductive pad through wires, and the photosensitive chip is provided with a coded layercorresponding to a side surface of the substrate, thereby simplifying the structure and reducing volume of the optical ruler read head.

Description

technical field [0001] The invention relates to an optical ruler, in particular to a sensing chip structure of an optical ruler reading head. Background technique [0002] The optical ruler is an important device for measuring small distances in the precision industry, such as image 3 As shown, it includes a measuring ruler 6 (commonly known as the main ruler) and an optical reading head 7, wherein the measuring ruler 6 is provided with a coding pattern (usually a grating pattern), and the optical reading head 7 is provided with a secondary ruler 71 And a photosensitive module 72, wherein the auxiliary ruler 71 is a glass block provided with a grating pattern, when the optical read head 7 and the measuring ruler 6 are relatively moved, the measuring ruler 6 and the grating on the auxiliary ruler 71 The patterns generate relative displacements, thereby resulting in continuous light intensity changes for the photosensitive module 72 to receive and convert, thereby measuring t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02
CPCG01B11/02H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 高清芬张家荣
Owner 台濠科技股份有限公司
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