Calculation method of dynamic junction temperature of igbt power module of wind power converter considering the influence of stray inductance
A technology for wind power converters and stray inductance, which is applied in the direction of output power conversion devices, wind power generation, electrical components, etc. It can solve the problem that it is difficult to characterize the weak links of converter power modules and cannot accurately reflect the dynamic thermal stress distribution of multi-chips To achieve the effect of improving thermal management control strategy, optimizing package heat dissipation design, and improving reliability
Active Publication Date: 2020-03-13
重庆平创半导体研究院有限责任公司
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However, the calculation results based on the assumption of uniform steady-state current distribution and the average loss distribution of the module cannot accurately reflect the dynamic thermal stress distribution of its internal multi-chips, and it is difficult to characterize the weak links inside the power module of the converter
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[0044] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0045] The preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. This embodiment selects a certain 1.5MW wind power converter IGBT module, the specific model is FF450R17ME4, and implements it under the premise of the technical solution of the present invention. The implementation mode and specific operation process.
[0046] figure 1 Shown is the specific calculation model of the method of the present invention. The purpose of the present invention is to provide a method for calculating the dynamic junction temperature of the wind power converter IGBT power module considering the influence of stray inductance. The method takes into account the influence of stray inductance , combined with the thermal network model considering the thermal coupling between chips, using ...
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The invention relates to a method for calculating the dynamic junction temperature of a wind power converter IGBT power module considering the influence of stray inductance, which belongs to the technical field of reliability of high-power power electronic devices for new energy power generation. The method includes: S1: according to the stray inductance The resulting dynamic uneven current between parallel multi-chips establishes the equivalent circuit model of the IGBT module; S2: deduces the mathematical relationship between the stray inductance parameters and the turn-on loss; S3: introduces the equivalent thermal coupling impedance, and establishes the thermal coupling between chips S4: Establish the dynamic junction temperature calculation model of the IGBT module, feed back the junction temperature thermal distribution results to the loss mathematical relationship model, and iterate back and forth to obtain the dynamic junction temperature distribution among the chips inside the IGBT module. The invention can accurately reflect the internal dynamic heat distribution of the IGBT power module, effectively characterize the thermal weak link inside the module, and can improve the thermal management control strategy of the wind power converter, thereby improving its reliability.
Description
technical field [0001] The invention belongs to the technical field of reliability of high-power power electronic devices for new energy power generation, and relates to a method for calculating the dynamic junction temperature of an IGBT power module of a wind power converter considering the influence of stray inductance. Background technique [0002] As the hub of wind energy conversion system, wind power converter is an important link that affects the stable and reliable operation of wind turbines. However, the long-term, large-scale and frequent random output of the unit has caused the converter to continue to suffer severe thermal stress shocks, and has become one of the components with the highest failure rate. In order to meet the application requirements of large-capacity converter power modules for wind turbines, multi-chip parallel connection is generally used to increase the power level. However, the uneven current distribution between parallel multi-chips and the...
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IPC IPC(8): H02M1/32H02J3/38
CPCH02J3/386H02M1/32H02M1/327Y02E10/76
Inventor 李辉胡玉王坤郑媚媚姚然胡姚刚全瑞坤何蓓刘晓宇
Owner 重庆平创半导体研究院有限责任公司
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