electronic module
A technology of electronic modules and electronic components, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as the inclination of connecting bodies, and achieve the effect of improving heat dissipation
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no. 1 approach
[0053] "constitute"
[0054] In the present embodiment, the "one side" refers to the figure 1 The upper side, the "other side" refers to the figure 1 The lower side. In addition, figure 1 The vertical direction is referred to as "first direction" left-right direction referred to as "second direction", the direction of the paper table is referred to as "third direction." Comprising a second in-plane direction and the third direction is the direction referred to as "surface direction", from the viewing referred to as "in plan view" side.
[0055] In this embodiment an electronic module, the electronic unit may have a first and a second electronic unit.
[0056] Such as figure 1 , The first electronic unit may have: a first substrate 11, disposed on the first substrate 11 side of the plurality of first conductive layer 12, a first electronic component and disposed on a side of the first conductor layer 12 of 13 . The first electronic component 13 may be a switching element, the contr...
no. 2 approach
[0087] Next, a second embodiment of the present invention will be described.
[0088] In this embodiment, if Figure 5 as well as Image 6FIG arranged three support portions 65 (65a-65c). Other configurations, since the embodiment as in the first embodiment, it is possible to employ any form of embodiment described in the first embodiment. Further, the same reference numerals will be used in the manner described in the first embodiment is used will be described.
[0089] The embodiment according to the present embodiment as the use of the support portion 65 form three, compared to four or more forms are disposed supporting portion 65, since the number of the support portions 65, and therefore advantageous to reduce the area of one-sided see . Further, even if only three support portions 65 are arranged, can be performed stably supported.
[0090] By adopting the configuration form three support portions 65, for example, even in case of using the surface morphology is not configured ...
no. 3 approach
[0094] Next, a third embodiment of the present invention will be described.
[0095] In this embodiment, if Figure 8 as well as Figure 9 , The support portion 65 does not have a plane direction of the support portion 166 only has a height direction of the support portion 165, and extends from the first head face 61 on the other side of the first substrate 1112 or the first straight conductor layer. Further, in the present embodiment, the supporting substrate is not disposed end portions extending in the plane direction. For other configuration, as in the above embodiments, it is possible to employ any form of the above described embodiments. Further, the same reference numerals will be used in each of the embodiments described above used to be described.
[0096] The embodiment of the present embodiment, since the other 65 from the face 61 of the head portion of the first side of the first substrate support portion 11 or the first conductive layer 12 extending in a straight line, ...
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