Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A defect detection method for PCB

A defect detection, PCB board technology, applied in image data processing, instrument, character and pattern recognition, etc., can solve problems such as low gray value and missed detection.

Active Publication Date: 2019-02-01
合肥九川智能装备有限公司
View PDF4 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limitation of optical resolution and lighting conditions, the gray value of the small or shallow (thin) residual copper area after imaging is not high, and there are areas with higher gray value than the base material, low The region of the gray value of the conductor and the characteristics of the region of the gray value below the binarization threshold, such as figure 2 As shown, therefore, it is regarded as the substrate in the binary image, resulting in missed detection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A defect detection method for PCB
  • A defect detection method for PCB
  • A defect detection method for PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0064] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0065] For the defect detection method of PCB, the steps are as follows:

[0066] The tiny defects of the PCB board are divided into micro short circuits, micro burrs and isolated defects according to the number of connected conductors, such as image 3 , wherein the tiny short circuit means a tiny defect connecting two conductors, the tiny burr means a tiny defect connecting a conductor, and the isolated defect means a tiny defect not connecting a conductor. For the first two types, the tiny short circuit and tiny burr will affect the electrical conductivity of the PCB board, so it needs to be detected, and for the isolated defect that is not connected to the conductor, it needs to be judged whether it is a blank area inside the clearance, if it is located In the blank area, the isolated defects located in the blank area need to be detected, while the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a defect detection method for a PCB, comprising the steps of: 1, generating a pixel type; 2, extracting suspicious pixels; 3, generating a suspicious area; 4, clustering thatregions into clusters; 5: making cluster attribute analysis. The method firstly finds the suspicious region in the image according to the characteristics of the gray level information of the tiny defect, and then determines whether the defect is a defect according to its position, so the defect can be detected.

Description

technical field [0001] The invention relates to the technical field of defect detection, in particular to a defect detection method for PCBs, in particular to a detection method for tiny defects of PCB boards. Background technique [0002] In people's life and work, electronic products play an increasingly important role, people rely more and more on electronic products, and at the same time, people have higher and higher requirements for the portability of electronic products. This demand makes electronic products continuously improve toward high integration and miniaturization, and the demand for high integration and miniaturization of printed circuit boards (PCB, Printed Circuit Board) is particularly obvious. [0003] In addition, with the rapid development of industries such as communications, computers and consumer electronics, the demand for the PCB industry is also increasing. At the same time, the quality requirements for printed circuit boards are also gradually i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/13G06K9/62
CPCG06T7/0004G06T7/13G06T2207/30141G06F18/23
Inventor 曾亚军姚毅刘士清赵敏
Owner 合肥九川智能装备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com