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Abrasives

A technology of abrasive grains and abrasive layers, used in abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of reduced grinding efficiency, reduced grinding rate time, clogging, etc., and achieve the effect of high grinding rate

Active Publication Date: 2021-01-05
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if such previous grinding materials continue to grind, the grinding dust will slowly accumulate between the grinding part and the object to be ground, and the abrasive grains of the grinding material will be difficult to contact with the object to be ground, so the so-called clogging will easily occur.
Therefore, in the aforementioned grinding materials, the grinding rate tends to decrease over time, and the grinding efficiency decreases.

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0038] Hereinafter, a first embodiment of the present invention will be described in detail with appropriate reference to the drawings.

[0039]

[0040] Figure 1A and Figure 1B The abrasive material 1 shown is disc-shaped and mainly includes a base sheet 10 and an abrasive layer 20 laminated on the surface side of the base sheet 10 . In addition, the abrasive material 1 includes an adhesive layer 30 laminated on the back side of the base sheet 10 . The grinding material 1 is disposed on a grinding platen of a known grinding device, and the grinding material is rotated while being brought into contact with a grinding object by the grinding device, thereby performing grinding. That is, the grinding direction of the grinding material 1 is the circumferential direction of the substrate sheet 10 .

[0041] (substrate sheet)

[0042] The base sheet 10 is a member for supporting the polishing layer 20 . The material of the substrate sheet 10 is not particularly limited, exam...

no. 2 approach

[0110] Hereinafter, a second embodiment of the present invention will be described in detail with appropriate reference to the drawings.

[0111] figure 2 The abrasive material 2 shown is disc-shaped and mainly includes a base sheet 11 and an abrasive layer 20 laminated on the surface side of the base sheet 11 . In addition, the abrasive material 2 includes an adhesive layer 30 laminated on the back side of the base sheet 11 . Furthermore, the abrasive material 2 includes a support 40 laminated via an adhesive layer 30 and a support adhesive layer 41 laminated on the back side of the support 40 . In addition, the same code|symbol is attached|subjected about the same component as 1st Embodiment, and description is abbreviate|omitted.

[0112] (substrate sheet)

[0113] The base sheet 11 is a member for supporting the polishing layer 20 . The base sheet 11 is divided into four along the polishing direction so that the first polishing region X and the second polishing region...

Embodiment approach

[0134] The present invention is not limited to the above-described embodiments, and can be implemented as various changes and improvements other than the above-described aspects.

[0135] In the above-mentioned embodiment, the case where the abrasive material is disc-shaped has been described, but the shape of the abrasive material is not limited to the disc shape. For example, the grinding material can be set in a square shape. The size of the abrasive material in the case of a square shape is not particularly limited, and may be, for example, a square shape in which one side is 140 mm or more and 160 mm or less.

[0136] In the above-described embodiment, the grooves are made into a grid shape, that is, the planar shape of the grinding part is made into a square shape, but the planar shape of the grinding part may not be a square shape, for example, it may be a shape in which polygons other than quadrilaterals are repeated, round shape etc.

[0137] In addition, the abrasi...

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Abstract

The abrasive material of the present invention has a substrate sheet, and a polishing layer laminated on the surface side of the substrate sheet and containing abrasive grains and a binder thereof, and the polishing layer is divided along the polishing direction and has Taber abrasion In the various grinding areas with different wear amounts in the test, the ratio of the wear amount of the grinding area with a large wear amount to the wear amount of a grinding area with a small wear amount in a pair of adjacent grinding areas is 1.1 or more, and 7 or less. There are two types of grinding areas, which can be arranged alternately along the grinding direction. The respective abrasive regions may have a size capable of containing a circle having a diameter of 5 cm in plan view.

Description

technical field [0001] The invention relates to a grinding material. Background technique [0002] In recent years, as substrates for precision electronic devices such as hard disks, light emitting diodes (Light Emitting Diode, LEDs), and power devices (power devices), the demand for difficult-to-process substrates such as glass, sapphire, and silicon carbide has increased. For polishing such a difficult-to-process substrate, planarization accuracy with less damage and a high polishing rate are required. [0003] In response to these demands, an abrasive material having a polishing portion in which diamond abrasive grains and fillers are dispersed has been proposed (see Japanese Patent Application Laid-Open No. 2002-542057). In the above-mentioned conventional abrasive material, as the surface of the object to be polished is polished, the filler falls off from the polished part, and the diamond abrasive grains protrude from the surface of the polished part. In the conventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B24D3/02B24D11/04
CPCB24D3/02B24D11/00B24D11/04
Inventor 西藤和夫下山贤治岩永友树笹岛启佑高木大辅八田朋树田浦歳和
Owner BANDO CHEM IND LTD