16results about How to "Increase grinding rate" patented technology

The invention relates to the technical field of automatic treatment of welding seams, and discloses automatic treatment equipment for welding seams on the inner and outer walls of an anti-corrosion storage tank, which comprises an equipment shell, an operation handle is fixedly connected right above the equipment shell, a driving motor is fixedly connected to the side wall of the equipment shell, and an output rotating shaft is fixedly connected to the output end of the driving motor. A fixing plate is arranged under the equipment shell. When the device is used, the positioning sliding rails on the fixing plate are firstly placed in the anti-corrosion tank, the positioning sliding rails are adjusted so that a welded welding seam can be located between the two positioning sliding rails, the clamping plates can ascend by rotating the lead screw, the clamping plates can be tightly attached to the outer wall of the anti-corrosion tank, and in this way, the positioning sliding rails can be fixed to the inner wall of the anti-corrosion tank conveniently; at the moment, the device is placed in the anti-corrosion tank, a first sliding block under an extrusion rod in an equipment shell is placed on two positioning sliding rails so that the first sliding block can stably slide above the positioning sliding rails, and therefore a grinding part of the device can conveniently and accurately grind a welding seam.

The invention belongs to the technical field of forge piece machining, and particularly relates to forge piece machining and grinding equipment which comprises a machine table, a frame plate is fixedly connected to the top of the machine table, a feeding pipe is fixedly connected to the inner wall of the frame plate, the forge piece machining and grinding equipment further comprises a grinding mechanism, and the bottom of the grinding mechanism is slidably connected with the top of the machine table; and the outer wall of the clamping mechanism is slidably connected with the inner wall of the frame plate, a cushion block is fixedly connected to the top of the machine table and located under the feeding pipe, the two first moving columns are symmetrically arranged, and the outer wall of the adjusting assembly is fixedly connected with the inner wall of the mounting frame. The axis of the forge piece is kept flush with the polishing mechanism, marks are prevented from being generated when the surface of the forge piece is rigidly clamped, dismounting and re-clamping are not needed, manual operation can be replaced through cooperation of the adjusting assembly and the auxiliary assembly, the polishing efficiency is improved, and the stability of the forge piece in the polishing process is kept.

The invention provides a device and a method for grinding a silicon wafer. The method comprises the following steps: acquiring an initial thickness value of each area on the surface of the silicon wafer before grinding the silicon wafer; when the surface of the silicon wafer is ground, the grinding thickness value of each area is obtained in real time; calculating the grinding amount of each area according to the grinding thickness value and the initial thickness value; grinding time is obtained, and the grinding rate of each area is calculated according to the grinding amount and the grinding time; and according to the demand feedback of the grinding rate of each area corresponding to the grinding liquid amount of the area, the movement time proportion and the movement speed of the nozzle relative to each grinding interval of the grinding disc are controlled, so that the thickness of each area on the surface of the ground silicon wafer meets the requirement. The method is used for adjusting the distribution state of the grinding fluid on the grinding disc in real time so as to improve the grinding rate of the thin film on the surface of the silicon wafer.

The invention discloses an ultra-wide grinding head cylinder outer circle polishing machine, and belongs to the technical field of polishing machines, the ultra-wide grinding head cylinder outer circle polishing machine comprises a grinding head mechanism, the grinding head mechanism comprises a lifting motor on a rack, an output shaft of the lifting motor extends to a first rotating tooth, and the outer wall of the first rotating tooth is in engaged transmission with a vertical gear plate fixed to a moving plate; a transverse gear plate matched with the movable plate is arranged on the movable plate in the length direction, a transverse moving motor fixed to the mounting base is arranged on the transverse gear plate, the transverse moving motor is in meshing transmission with the transverse gear plate through second rotating teeth, and the mounting base is connected with a sliding rail in the length direction of the transverse gear plate; and a grinding head motor is fixedly mounted on the mounting seat. The technical problems that an existing cylinder surface treatment mechanism cannot achieve automatic feeding and discharging, working efficiency is affected, meanwhile, personnel operation is not facilitated, and adaptive size adjustment cannot be conducted on cylinders with different diameters, polishing workpieces and a supporting mechanism can be solved.

This polishing material slurry comprises: manganese oxide abrasive grains containing manganese oxide particles; permanganate ions; a phosphoric acid; and a polymer additive containing one or more water-soluble organic polymers selected from the group consisting of polycarboxylic acids, polycarboxylate salts, salts of naphthalene sulfonic acid formaldehyde condensates, polyvinyl alcohol, polyethylene glycol, polyvinylpyrrolidone, and copolymers thereof. The method for polishing the polishing material slurry according to the present invention comprises polishing an object to be polished using the polishing material slurry according to the present invention.

The utility model discloses a titanium alloy plate surface polishing device which comprises an operation table, a moving seat is arranged in the middle of the top of the operation table, a hydraulic cylinder is installed on the top of the moving seat, and a movable seat is arranged on the top of the inner surface of the moving seat. The output end of the hydraulic cylinder penetrates through the moving seat and is fixedly connected with the surface of the top of the movable seat, racks are fixedly connected to the surfaces of the two sides of the operation table, first motors are installed on the surfaces of the two sides of the moving seat, and the output ends of the first motors are fixedly connected with movable shafts; the sides, close to each other, of the movable shafts penetrate through the moving seat and extend to the position of the inner surface of the moving seat, and the outer circumferential faces, extending to the position of the inner surface of the moving seat, of the movable shafts are fixedly sleeved with first gears. The plate polishing device has a certain polishing range, and a user can polish long plates conveniently.

The utility model provides a kind of steel ingot polishing device, including workbench, workbench upper portion is provided with driving mechanism, driving mechanism is used to drive four sliders to move, driving mechanism includes four sliders, four sliders upper portion is connected with bearing seat, every two opposite bearing seat is rotatably connected with a rotating roller, the outer lateral wall of two rotating rollers is wound with annular abrasive band, two rotating rollers one end is connected with the output shaft of first motor by coupling, workbench upper portion is provided with pressing mechanism, and it is simple to operate by the rotating roller cooperation annular abrasive band to make, and production cost is lower, and it can be used without equipping professional technical personnel, and then it can reduce early investment cost and personnel investment cost, and it is convenient to maintain and replace, beneficial to save later use cost, further improve overall production efficiency.

The invention relates to the technical field of sheet metal processing, and discloses an edge grinding device for processing a snow thrower protective cover, comprising a protective cover shell, a base, a grinding box, an eccentric counterweight, a high-frequency oscillation generator, a positioning and mounting assembly, an abrasive separation assembly and a clamping assembly; the invention drives an abrasive formed by a mixture of corundum, brown corundum and white corundum to oscillate at high speed through a high-frequency oscillating grinding box, and oscillates and layers the abrasive through the setting of a high-frequency oscillation generator, so that the protective cover shell can be ground by abrasives of different depths, and the protective cover shell is polished in turn as the insertion depth of the protective cover shell is different, so that the abrasives of different particle sizes and hardnesses can ensure the grinding accuracy while improving the grinding rate, the operation is simple and the processing is convenient, and the synchronous grinding of irregular edges is realized, and repeated manual grinding is unnecessary, thereby improving the processing rate and automation degree of the equipment.

The invention provides a manufacturing method of a semiconductor device, which comprises the following steps of: providing a semiconductor substrate comprising a first pattern region and a second pattern region, and performing floating gate polycrystalline silicon deposition on the semiconductor substrate to form a first polycrystalline silicon layer; the pattern density of the first pattern area is greater than that of the second pattern area; performing ion implantation on the first polycrystalline silicon layer, and forming an oxide layer on the top surface of the first polycrystalline silicon layer; protecting the oxide layer of the second pattern area and etching the oxide layer of the first pattern area; performing chemical mechanical polishing treatment on the first polycrystalline silicon layer in the first pattern area and the oxide layer and the first polycrystalline silicon layer in the second pattern area; and generating the semiconductor device based on the first polycrystalline silicon layer after the chemical mechanical polishing treatment. The thickness of the polycrystalline silicon layer in the areas with different pattern densities can be ensured to be consistent, so that the reliability of the semiconductor device is improved, and the process is simple and convenient, high in flexibility and easy to implement.

This polishing material slurry comprises manganese oxide abrasive grains containing manganese oxide particles, permanganate ions, and phosphoric acids. The method for polishing the polishing material slurry according to the present invention comprises polishing an object to be polished using the polishing material slurry according to the present invention.

The invention discloses a soft chemical mechanical polishing pad with a larger contact area and a preparation method and application of the soft chemical mechanical polishing pad, polyester polyol used in polyurethane resin of a main body structure of a polishing layer is synthesized by using 1, 6-hexanediol as a raw material, small molecule alcohols are added in coating slurry, the surface roughness of the obtained polishing layer is controlled, and the surface roughness of the polishing layer is controlled. The soft chemical mechanical polishing pad is obtained. According to the soft chemical mechanical polishing pad prepared through the method, only the soft section type of polyurethane in the polishing pad body structure needs to be controlled, the surface roughness of the polishing layer during rear section machining needs to be controlled, the contact area of the polishing pad and the surface of a workpiece in the grinding process can be increased, and the grinding speed is increased.

The utility model discloses a grinding and polishing device for surface treatment of automobile motor parts, which relates to the field of automobile part processing, and comprises an electric slide rail, the top surface of the electric slide rail is fixedly connected with a U-shaped support plate, the top surface of the U-shaped support plate is provided with a turntable, the inside of the U-shaped support plate is fixedly connected with a servo motor, and the servo motor is fixedly connected with the turntable. The output end of the servo motor is fixedly connected with the bottom face of a rotating disc, and a set of supporting plates are arranged on the top face of the rotating disc. According to the polishing device, the two supporting plates are arranged, the polishing blocks are arranged on the surfaces of the two supporting plates, after the outer wall of the motor shell is polished and polished, the motor shell is fixed through the clamping plates, then the inner wall of the motor shell is polished by rotating the two supporting plates, a large amount of manual workload is saved, and the polishing speed is increased.

The utility model discloses precise grinding equipment for automobile bolts, relates to the field of bolt machining, solves the problem that an existing device is difficult to efficiently grind and machine threaded columns of bolt pieces according to requirements, and adopts the following scheme that the precise grinding equipment comprises a support, a micro motor and an electric cylinder seat, and the micro motor and the electric cylinder seat are installed on the support and opposite in position; the outer end of an output shaft of the micro motor is fixedly connected with a limiting seat, a stepped clamping groove is formed in the front side of the limiting seat, and the clamping groove is a notch matched with a bolt head in specification; the outer end of an output shaft of the electric cylinder base is fixedly connected with a bearing barrel, the outer end of the bearing barrel is fixedly connected with a polishing barrel, and the polishing barrel is a columnar barrel. According to the precise grinding equipment for the automobile bolt, through the arrangement of the support and all assemblies on the inner side of the support, the bearing barrel can be driven by the electric cylinder base to move left and right on the outer side of a threaded column of a bolt piece and synchronously rotate under the influence of threaded sleeving, and the threaded column of the bolt piece is efficiently ground through the hemispherical grinding force on the inner side of the bearing barrel.

The invention discloses a high-temperature-resistant phase-change ceramic fiber material production method and device, the device comprises a base, a fixing frame is mounted at the top of the base, a grinding bottom cylinder is mounted at the top of the fixing frame in an embedded manner, a fixing assembly is mounted in the grinding bottom cylinder, and the fixing assembly is used for mounting and fixing a grinding bottom plate; the top of the base is provided with a stirring barrel, the stirring barrel is located on the rear side of the fixing frame, the top of the base is provided with a drying box, and the drying box is located on one side of the stirring barrel. According to the production device, the fixing assembly is arranged, and the filter plate and the grinding bottom cylinder can be movably connected through the fixing assembly, so that grinding filter plates with different mesh numbers can be replaced conveniently, and the applicability of the production device is improved.

The utility model discloses a raw material grinding device for essential oil extraction, and relates to the technical field of raw material grinding. A grinding groove is formed in the lower end of the box body; a motor is arranged at the upper end of the box body; a shaft rod is arranged at the output end of the motor; a cutting and scraping assembly is arranged at the side part of the shaft rod; an electric push rod is arranged in the shaft rod, a connecting frame is arranged at the output end of the electric push rod, a grading ring is arranged on the lower portion of the connecting frame, a first material collecting groove is formed in the upper portion of the circumferential side of the inner wall of the grinding groove, a second material collecting groove is formed in the upper portion of the circumferential side of the grinding disc, and the grading ring is clamped in the first material collecting groove and the second material collecting groove. The first material collecting groove and the second material collecting groove are matched with the grading ring, so that a certain amount of crushed raw materials can slide into the first material collecting groove and the second material collecting groove conveniently, and the crushed raw materials are transited from the leakage groove to the position between the grinding disc and the inner wall of the grinding groove.

This disclosure provides a retaining ring and a polishing apparatus. The retaining ring includes an annular body having an inner peripheral wall, an outer peripheral wall, and a polishing surface connecting the top ends of the inner and outer peripheral walls. The annular body also has a plurality of spaced grooves recessed from the polishing surface, extending from the inner peripheral wall to the outer peripheral wall and communicating through it. The width between the two sidewalls of each groove is not entirely the same in a direction perpendicular to the bottom wall of the groove, and the sum of the widths between the bottom ends of the two sidewalls of all grooves is greater than or equal to the sum of the widths between the top ends of the two sidewalls of all grooves. The retaining ring of this disclosure can reduce polishing defects on the surface of semiconductor structures and improve the polishing rate.