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40results about How to "Strong grinding force" patented technology

Method for preparing resin grinding wheel

The invention discloses a method for preparing a resin grinding wheel. The method comprises the following steps: (1) placing 70-85 parts by weight of white corundum into 10-15 parts by weight of acrylic emulsion to be soaked, evenly mixing 6-8 parts by weight of polytetrafluoroethylene powder, 1-2 parts by weight of boron nitride, 15-20 parts by weight of cryolite and 30-35 parts by weight of phenolic resin powder with the soaked white corundum, and enabling the mixture to pass through 20-25-mesh standard screens to obtain a grinding wheel mixture; (2) taking a glass fiber cloth, coating the two faces of the glass fiber cloth with phenolic resin, then placing the glass fiber cloth into a drying oven, and baking the glass fiber cloth at the temperature of 135-140 DEG C for 15-20min to obtain glass fiber pieces; (3) placing the glass fiber mixture into a forming mold, spreading the glass fiber mixture, completely embedding the glass fiber pieces into the grinding wheel mixture, and conducting compression forming to obtain a grinding wheel green body; (4) placing the grinding wheel green body into a sintering furnace to be sintered; (5) machining the sintered grinding wheel green body on a lathe and a grinding machine to obtain the finished resin grinding wheel. When resin grinding wheel prepared by the method is used, harmful gas caused by oxidation can not emit.
Owner:CHANGSHU JULI GRINDING WHEEL

Self-sharpening resin binder diamond grinding wheel and preparation method thereof

The invention discloses a self-sharpening resin binder diamond grinding wheel and a preparation method thereof. The formula of the grinding wheel comprises the following components of, in percentage by volume, 15%-65% of foam diamond, 15%-45% of phenolic resin powder, 2%-15% of chromic oxide, 0%-15% of zinc oxide, 2%-10% of graphite, 16%-50% of silicon carbide, 0%-3% of pore forming agent, 0%-3% of a coupling agent, and 0%-5% of a wetting agent. According to the self-sharpening resin binder diamond grinding wheel and the preparation method thereof, compared with an existing grinding wheel, the self-sharpening resin binder diamond grinding wheel prepared through the method is characterized in that the foam diamond, the pore forming agent, the wetting agent and the coupling agent are added, the effective contact area between the foam diamond and the binder is increased, abrasive particles cannot fall off integrally due to the inlaying effect of the foam structure of the foam diamond and the binder, the diamond grinding wheel is even in consumption in the using process, the finishing frequency can be effectively reduced, good grinding force is kept, meanwhile, the self-sharpening performance of a grinding tool is improved, cutting damage is effectively reduced, and the workpiece surface machining quality is improved.
Owner:XINYA COMPOSITE SUPER HARD MATERIAL CO LTD ZHENGZHOU

Composite binder grinding wheel for machining large-size silicon carbide substrate and preparation method of composite binder grinding wheel

The invention discloses a composite binder grinding wheel for machining a large-size silicon carbide substrate and a preparation method of the composite binder grinding wheel, and particularly relates to a formula and a preparation method of a composite binder superhard-material grinding wheel for machining a silicon carbide semiconductor material. The formula mainly comprises the following components of 25%-45% of diamond abrasives, 25%-40% of pre-alloyed powder, 8%-20% of polyphenylene sulfide, 10%-18% of zinc oxide whiskers and 8%-22% of SG abrasives. According to the preparation method, the polyphenylene sulfide and zinc-copper alloy powder are adopted as a composite binder system, and the binder system is high in abrasive holding force, resists high grinding resistance of large-size silicon carbide and is high in grinding force. The grain structure of an alloy system is refined through iron, aluminum and the like, brittleness is increased, and grinding sharpness of the grinding wheel is improved. Meanwhile, the isotropy of the microstructure of a grinding wheel layer can be improved through utilization of the whiskers and the like, a good homogeneous state is obtained, and the grinding stability problem of the silicon carbide substrate is solved. The machining problem of the large-size silicon carbide substrate is thoroughly solved.
Owner:ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD

A kind of production recipe method of polishing wheel

The invention discloses a polishing wheel. The polishing wheel comprises the following raw materials including silicon carbide, brown aluminium oxide, industrial salt and resin-oatmeal. The invention further discloses a preparation method for the polishing wheel. The polishing wheel adopts resin binder, grinding materials are formed by choosing and compounding the silicon carbide and the brown aluminium oxide, since the two grinding materials are chosen and mixed, the relationship between the hardness and the toughness of the grinding materials can be adjusted, the polishing wheel has the properties and advantages of the two grinding materials, and therefore the grinding performance of the polishing wheel is improved, and the polishing wheel has the advantages of being high in hardness, good in self-sharpening performance, strong in grinding force and low in heat production amount; meanwhile, the preparation technology adopts the high-temperature pressing technology, the mechanical strength of the polishing wheel is further strengthened, and the grinding efficiency of the polishing wheel to workpieces is obviously improved. According to the production formula method for the polishing wheel, the produced polishing wheel is good in grinding performance, high in mechanical strength and long in service life.
Owner:贵阳高新恒至磨料磨具厂

Composite bond grinding wheel for large-size silicon carbide substrate processing and preparation method thereof

The invention discloses a composite bond grinding wheel for large-scale silicon carbide substrate processing and a preparation method thereof, in particular to a compound bond superhard material grinding wheel formula and a preparation method for silicon carbide semiconductor material processing. The formula mainly consists of the following components: 25-45% diamond abrasive, 25-40% pre-alloyed powder, 8-20% polyphenylene sulfide, 10-18% zinc oxide whisker, and 8-22% SG abrasive. The preparation of the invention adopts polyphenylene sulfide and zinc-copper alloy powder as a composite binder system, and the binder system has strong holding force on abrasives, resists high grinding resistance of large-sized silicon carbide, and has strong grinding force. Iron, aluminum, etc. refine the grain structure of the alloy system, increase the brittleness, and improve the grinding sharpness of the grinding wheel. At the same time, the use of whiskers can increase the isotropy of the microstructure of the grinding wheel layer, obtain a better homogeneous state, and solve the problem of grinding stability of silicon carbide substrates. It completely solves the problem of processing large-size silicon carbide substrates.
Owner:ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD

A production process of high-strength green silicon carbide micropowder and its special grinding machine

The invention discloses a production process for high-strength green silicon carbide micropowder and a special grinder for the high-strength green silicon carbide micropowder. The special grinder comprises a horizontal mill body (1), a slurry circulation pump (2), an iron remover (4) and a settling tank (5), wherein the discharge hole of the horizontal mill body (1) is communicated with the feeding hole of the settling tank (5) by virtue of a slurry conveying pipeline A (3), the iron remover (4) is arranged between the slurry conveying pipeline A (3) and the feeding hole of the settling tank (5), the discharge hole of the settling tank (5) is communicated with a feeding hole of the horizontal mill body (1) by virtue of a slurry conveying pipeline B (3'), and a slurry flow control valve (8) is arranged on the slurry conveying pipeline B (3'). According to the production process for high-strength green silicon carbide micropowder and the special grinder disclosed by the invention, the problem of the traditional green silicon carbide micropowder that the strength and the cutting force are influenced as the particle sizes of the traditional green silicon carbide micropowder are different is solved, and the problem of the traditional grinder that in the grinding process, powders in different particle sizes are mixed and ground to cause excessive grinding is also solved.
Owner:HUAIAN LITAI SILICON CARBIDE MICRO POWDER

Method for machining variable-section nozzle ring blade of turbocharger

The invention discloses a method for machining a variable-section nozzle ring blade of a turbocharger. The method includes clamping a blade (1) on a rotary fixture; manufacturing a grinding wheel (2) according to the shape of the blade; acquiring the ratio of the feeding width to the feeding depth of the grinding wheel according to ground quantities of a blade rod (3) and a lower end surface (4) of the blade; enabling the grinding wheel to rotate under the control of a computer and obliquely feeding the grinding wheel according to a ratio angle relative to the blade; grinding and machining the blade rod and the lower end surface of the blade simultaneously and automatically measuring the blade rod and the lower end surface of the blade; and automatically withdrawing the grinding wheel after machining requirements are met until a workpiece is machined. The method has the advantages that the blade rod and the lower end surface of the variable-section nozzle ring blade which originally needs to be machined on a plurality of different machine tools in a plurality of working procedures can be simultaneously machined on a single machine tool in a single working procedure, accordingly, labor, materials and the machining time are saved, and the machining efficiency is improved; and the blade machining precision and the mechanical strength of the blade can be guaranteed, and the machining quality can be improved.
Owner:PINGXIANG DEBO TECH CO LTD

Large-bevel-edge 2.5 D cover plate machining device and machining method

The invention provides a large-bevel-edge 2.5 D cover plate machining device and method, and relates to the field of glass machining and manufacturing, the large-bevel-edge 2.5 D cover plate machining device comprises a cover plate fixing mechanism, a first grinding wheel rod and a second grinding wheel rod, the first grinding wheel rod is provided with a first cutting edge face, and the first cutting edge face is a first conical face with the large upper portion and the small lower portion; the second grinding wheel rod is provided with a second cutting edge surface and a third cutting edge surface which are consistent in shape, the second cutting edge surface comprises a second conical surface, a third conical surface, a fourth conical surface, a cylindrical surface and a fifth conical surface which are sequentially connected from top to bottom, and the roughness of the first cutting edge surface, the second cutting edge surface and the third cutting edge surface is sequentially reduced. A large bevel edge is machined at a time through the first cutting edge face, a contour is formed at the upper position and the lower position of the large bevel edge at a time through the second cutting edge face, and finally the contour of a rough product is finely trimmed through the third cutting edge face, so that the cover plate is obtained through complete forming, and beveling trimming is not needed. The processing yield and the processing efficiency are higher, and the standard reaching rate of the product size and the processing precision are improved.
Owner:LENS TECH CHANGSHA
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