Suspension auxiliary agent applied to grinding of large-size silicon wafer, and preparation method and application thereof

Abstract

The invention provides a suspension auxiliary agent applied to grinding of a large-size silicon wafer, a preparation method and application thereof. The suspension auxiliary agent comprises the following components in parts by weight: 0.5 to 5 parts of a hydrogen bond thixotropic agent, 0.5 to 5 parts of a suspension synergist, 0.1 to 1 part of a charge neutralizer, 0.5 to 10 parts of a dispersant, 10 to 20 parts of a lubricant, 0.1 to 0.5 part of an antirust agent, and 50 to 85 parts of water. The invention also discloses a preparation method of the suspension auxiliary agent. The preparation method comprises the following steps: sequentially adding the dispersant, the lubricant, the charge neutralizer and the antirust agent into the deionized water; heating to 40 DEG C, adding the hydrogen bond thixotropic agent into the solution, and standing to swell and stabilize the emulsion; and adding the suspension synergist into the solution to prepare the suspension auxiliary agent applied to large-size silicon wafer grinding. The prepared suspension auxiliary agent can effectively improve the suspension performance of the composite abrasive material, has good dispersity on different abrasive materials, and avoids abrasive material agglomeration and abrasive material hard precipitation in circulating grinding.

Description

technical field [0001] The invention relates to a grinding suspension aid technology, in particular to a suspension aid used in large-size silicon wafer grinding, its preparation method and application. Background technique [0002] With the development of semiconductor material technology, higher requirements are placed on the specifications and quality of silicon wafers, and the proportion of demand for large-diameter silicon wafers suitable for micro-processing will increase day by day. In the manufacturing process of large-size single crystal silicon wafers for semiconductors, the grinding technical indicators of silicon wafers are more stringent. It is necessary to make the silicon wafers have lower roughness, smaller thickness difference and lower depth of damage layer. The grinding process is The key step to maintain the quality of silicon wafers, and the suspension aid used in this step is one of the core technologies that affect the grinding index, which poses new t...

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Problems solved by technology

[0005] The object of the present invention is to propose a kind of suspending aid applied to the grinding of large-size silicon wafers for the low grinding rate of the current silicon wafer grinding liquid, which can easily produce surface scratches when used for silicon wafer grinding. Effectively increase the suspension performance of composite abrasives, and at the same time have good dispersion for different abrasives, avoiding the formation of abrasive agglomeration and abrasive hard precipitation in cyclic grinding

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