Grinding liquid supply and grinding pad trimming device and grinding drilling crew

Abstract

The invention discloses a grinding liquid supply and grinding pad trimming device and a grinding drilling crew. The grinding liquid supply and grinding pad trimming device comprises a grinding liquid supply system, a cavity communicated with the grinding liquid supply system, a drainage plate arranged in the cavity and provided with multiple drainage holes and a drive system for bearing and driving the cavity. The grinding liquid supply system is used for providing boosted grinding liquid. The pressure of the boosted grinding liquid is larger than or equal to 50 MPa. The boosted grinding liquid is sprayed to a grinding pad through the cavity via the drainage holes. According to the grinding liquid supply and grinding pad trimming device and the grinding drilling crew, the grinding pad is scoured through the boosted grinding liquid to be trimmed, meanwhile, the cavity moves on the surface of the grinding pad so that the grinding liquid can be distributed more evenly, the grinding rate of the grinding pad is increased, the service life of the grinding pad trimming device is prolonged greatly, and thus cost is lowered.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a polishing liquid supply and polishing pad finishing device and a polishing machine platform in a CMP process. Background technique [0002] With the rapid development of VLSI, the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the feature size of components is getting smaller and the number of components per unit area of ​​the chip is increasing. It is difficult for planar wiring to meet the requirements of high-density distribution of components. Multilayer wiring technology can only be used to take advantage of the verticality of the chip. Space, and further increase the integration density of the device. However, the application of multi-layer wiring technology will cause the surface of the chip to be uneven, which is extremely unfavorable fo...

AI Technical Summary

Problems solved by technology

At present, the most commonly used grinding pad finishing technology for chemical mechanical polishing is to use a diamond wheel finisher to scrape the surface of the grinding pad, but as the diamond wheel finisher is used, the sharpness of the diamonds on the surface of the diamond wheel finisher gradually decreases. The finishing ability of the grinding pad gradually decreases, and the grinding rate also gradually decreases, so the diamond wheel finisher needs to be replaced regularly to maintain a stable grinding rate

And because the diamond wheel finisher frequently scratches the surface of the grinding pad, the service life of the diamond wheel finisher is short and needs to be replaced frequently, so the cost of manpower and material resources is also very expensive

Moreover, affected by the batch performance of the diamond wheel finisher, the diamond drop of the diamond wheel finisher often occurs during the grinding process. The dropped diamonds will cause serious scratches on the wafer surface, resulting in the scrapping of the silicon wafer.

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