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Carbamate resin composition for polishing pad and polyurethane polishing pad

A technology of urethane and resin composition, which is applied in the field of polyurethane grinding pads, can solve the problems of several months of curing time, the lack of grinding pads, and unstable quality. scratchy effect

Active Publication Date: 2013-04-24
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned free abrasive pads, the R value is set at a relatively low level of 0.7 to 0.9 in order to control the amount of wear, so the polyurethane resin is slightly brittle, and the aging time is several months, and the quality is not stable.
In addition, the above-mentioned fixed abrasive type polishing pad, which is a non-loose abrasive type, has the problem that scratches are likely to occur anyway.
[0007] To sum up, from the perspective of the industry, the actual situation is that although there is a strong demand for high-polishing rate, non-scratch, and flatness polishing pads that meet the continuous requirements for precision polishing, such polishing pads have not yet appeared.

Method used

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  • Carbamate resin composition for polishing pad and polyurethane polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] [Example 1] "Manufacture of Polyurethane Polishing Pad (P-1)"

[0079] 37 parts by mass of toluene diisocyanate ("TDI-100", manufactured by Nippon Polyurethane Industry Co., Ltd.) was placed in a 4-necked round-bottomed flask equipped with a nitrogen gas inlet tube, a cooling condenser, a thermometer, and a stirrer, and stirring was started. Next, 63 parts by mass of polytetramethylene glycol (number-average molecular weight: 1000) was added and mixed, and reacted at 60°C for 8 hours under a nitrogen stream to obtain a urethane prepolymer with an isocyanate group equivalent of 335 (A -1). To the obtained urethane prepolymer (A-1), 1.25 parts by mass of hydrophilic silica (trade name: "Reolosil QS20L", specific surface area = 220m 2 / g, manufactured by Tokuyama Co., Ltd.), fully mixed in a Disper disperser to form the first component. The isocyanate group equivalent weight of the obtained first component was 342.

[0080] Next, 3,3'-dichloro-4,4'-diaminophenylmethane ...

Embodiment 2

[0088] [Example 2] "Manufacture of Polyurethane Polishing Pad (P-2)"

[0089] In addition to changing the hydrophilic silica (trade name: "Reolosil QS20L") to hydrophobically modified fumed silica (trade name: "AEROSIL RY200S", specific surface area = 130m 2 / g, manufactured by Nippon Aerosil Co., Ltd.), a polyurethane polishing pad (P-2) was obtained in the same manner as in Example 1.

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Abstract

The invention aims at providing a CMP method polishing pad having excellent polishing characteristics (high polishing rate, non-scraping, and flatness). The invention relates to a carbamate resin composition for the polishing pad which comprises a base resin of isocyanate group-containing carbamate prepolymer (A) and a curing agent (B) of a functional group which reacts with isocyanate group and also fumed silica (C). In addition, a polyurethane polishing pad obtained by using the composition is also provided.

Description

technical field [0001] The present invention relates to a urethane resin composition for a thermosetting urethane (TSU) type polishing pad that can be used in the field of glass polishing of glass substrates, silicon wafers, semiconductor devices, etc., and polyurethane polishing obtained by using the composition pad. Background technique [0002] Glass substrates for liquid crystal displays (LCDs), glass substrates for hard disk drives (HDDs), glass disks for recording devices, optical lenses, silicon wafers, semiconductor devices, etc. require high levels of surface flatness and in-plane uniformity. [0003] For semiconductor devices, along with the rapid increase in the integration level of semiconductor circuits, miniaturization and multilayer wiring for the purpose of high density are progressing, and the technology of further flattening the processed surface is becoming important. On the other hand, in the glass substrate for liquid crystal displays, higher flatness o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L75/08C08K3/36C08K9/06C08G18/10C08G18/48
CPCB24B37/24C08G18/12C08G18/32C08K3/36C08L75/04H01L21/304
Inventor 小田善之须崎弘
Owner DIC CORP
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